|
Availability
|
|
|
Filler / Reinforcement
|
|
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Processing Method
|
|
| Physical |
Nominal Value
|
Unit
|
Test Method
|
|
Density
|
1.46
|
g/cm³
|
ISO 1183 |
|
Molding Shrinkage
|
ISO 294-4 | ||
|
Across Flow
|
1.0
|
%
|
|
|
Flow
|
0.20
|
%
|
|
|
Water Absorption
|
ISO 62 | ||
|
Saturation, 23°C
|
5.0
|
%
|
|
|
Equilibrium, 23°C, 50% RH
|
1.6
|
%
|
| Mechanical |
Nominal Value
|
Unit
|
Test Method
|
|
Tensile Modulus (23°C)
|
13000
|
MPa
|
ISO 527-2 |
|
Tensile Stress (Break, 23°C)
|
215
|
MPa
|
ISO 527-2 |
|
Tensile Strain (Break, 23°C)
|
3.0
|
%
|
ISO 527-2 |
|
Flexural Modulus (23°C)
|
11000
|
MPa
|
ISO 178 |
|
Flexural Strength (23°C)
|
300
|
MPa
|
ISO 178 |
| Impact |
Nominal Value
|
Unit
|
Test Method
|
|
Charpy Notched Impact Strength
|
ISO 179/eA | ||
|
-30°C
|
13
|
kJ/m²
|
|
|
23°C
|
16
|
kJ/m²
|
|
|
Charpy Unnotched Impact Strength
|
ISO 179/eU | ||
|
-30°C
|
80
|
kJ/m²
|
|
|
23°C
|
90
|
kJ/m²
|
|
|
Notched Izod Impact Strength
|
ISO 180/1A | ||
|
-30°C
|
12
|
kJ/m²
|
|
|
23°C
|
15
|
kJ/m²
|
| Thermal |
Nominal Value
|
Unit
|
Test Method
|
|
Heat Deflection Temperature
|
|||
|
0.45 MPa, Unannealed
|
260
|
°C
|
ISO 75-2/B |
|
1.8 MPa, Unannealed
|
255
|
°C
|
ISO 75-2/A |
|
Vicat Softening Temperature
|
255
|
°C
|
ISO 306/B |
|
Melting Temperature (DSC)
|
262
|
°C
|
ISO 3146 |
| Electrical |
Nominal Value
|
Unit
|
Test Method
|
|
Surface Resistivity
|
1.0E+13
|
ohm
|
IEC 60093 |
|
Volume Resistivity
|
1.0E+15
|
ohm·cm
|
IEC 60093 |
|
Comparative Tracking Index
|
500
|
V
|
IEC 60112 |
| Flammability |
Nominal Value
|
Unit
|
Test Method
|
|
Flame Rating
|
UL 94 | ||
|
1.60 mm
|
HB
|
|
|
|
3.20 mm
|
HB
|
|
|
|
Glow Wire Ignition Temperature (2.00 mm)
|
650
|
°C
|
IEC 60695-2-13 |
| Additional Information |
Nominal Value
|
Unit
|
Test Method
|
|
Filler Content
|
40
|
%
|
ISO 3451 |
| Injection |
Nominal Value
|
Unit
|
|
|
Drying Temperature
|
80.0
|
°C
|
|
|
Drying Time
|
2.0
|
hr
|
|
|
Suggested Max Moisture
|
0.20
|
%
|
|
|
Suggested Max Regrind
|
25
|
%
|
|
|
Processing (Melt) Temp
|
270 to 300
|
°C
|
|
|
Mold Temperature
|
50.0 to 110
|
°C
|
|
|
Holding Pressure
|
50.0 to 100
|
MPa
|
|
| Injection Notes | |||
|
Back Pressure: Low
|
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