- 熔体流动速率 [g/10min]: 6.0
- 密度 [g/cm3]: 1.05
- 拉伸强度 [MPa]: 36.0
- 弯曲模量 [MPa]: 2.70
- 热变形温度 [℃]: 125.0
Physical Properties | Metric | English | Comments | ||
---|---|---|---|---|---|
Density | 1.05 g/cc | 0.0379 lb/in³ | ISO 1183 | ||
Linear Mold Shrinkage | 0.011 cm/cm | 0.011 in/in | Borealis Method; average process | ||
Melt Flow | 6.0 g/10 min @Load 2.16 kg, Temperature 230 °C | 6.0 g/10 min @Load 4.76 lb, Temperature 446 °F | ISO 1133 | ||
27.5 g/10 min @Load 5.00 kg, Temperature 230 °C | 27.5 g/10 min @Load 11.0 lb, Temperature 446 °F | ISO 1133 | |||
Mechanical Properties | Metric | English | Comments | ||
Ball Indentation Hardness | 80.6 MPa | 11700 psi | 358 N/30s; ISO 2039 | ||
Tensile Strength, Yield | 36.0 MPa | 5220 psi | 50mm/min; ISO 527-2 | ||
Elongation at Yield | 10 % | 10 % | 50mm/min; ISO 527-2 | ||
Flexural Modulus | 2.70 GPa | 392 ksi | 2mm/min; ISO 178 | ||
Charpy Impact Unnotched | 1.37 J/cm² @Temperature -20.0 °C | 6.52 ft-lb/in² @Temperature -4.00 °F | ISO 179/1eU | ||
4.20 J/cm² @Temperature 23.0 °C | 20.0 ft-lb/in² @Temperature 73.4 °F | ISO 179/1eU | |||
Charpy Impact, Notched | 0.120 J/cm² @Temperature -20.0 °C | 0.571 ft-lb/in² @Temperature -4.00 °F | ISO 179/1eA | ||
0.300 J/cm² @Temperature 23.0 °C | 1.43 ft-lb/in² @Temperature 73.4 °F | ISO 179/1eA | |||
Thermal Properties | Metric | English | Comments | ||
Deflection Temperature at 0.46 MPa (66 psi) | 125 °C | 257 °F | ISO 75-2 | ||
Deflection Temperature at 1.8 MPa (264 psi) | 70.0 °C | 158 °F | ISO 75-2 | ||
Processing Properties | Metric | English | Comments | ||
Processing Temperature | 220 - 260 °C | 428 - 500 °F | mass temperature | ||
Feed Temperature | 40.0 - 80.0 °C | 104 - 176 °F | |||
Mold Temperature | 30.0 - 50.0 °C | 86.0 - 122 °F | |||
Injection Velocity | 100 - 200 mm/sec | 3.94 - 7.87 in/sec | |||
Hold Pressure | 30.0 - 60.0 MPa | 4350 - 8700 psi | |||
Descriptive Properties | |||||
Back Pressure | low to medium | ||||
Emission (µgC/g) | < 50 | VDA 277 | |||
Fogging (mg) | < 2 | 100°C, 16h; DIN 75201 | |||
Screw Speed | low to medium |