- 密度 [g/cm3]: 1.85
- 弯曲模量 [MPa]: 12.5
- 热变形温度 [℃]: 300.0
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Density | 1.85 g/cc | 0.0668 lb/in³ | ISO 1183 |
| Density of Compound | 1.62 g/cc | 0.0585 lb/in³ | melt; Internal |
| Mechanical Properties | Metric | English | Comments |
| Tensile Strength at Break | 88.0 MPa | 12800 psi | 5mm/min; ISO 527-2/1A |
| Elongation at Break | 1.40 % | 1.40 % | 5mm/min; ISO 527-2/1A |
| Tensile Modulus | 15.8 GPa | 2290 ksi | 1mm/min; ISO 527-2/1A |
| Flexural Strength | 165 MPa | 23900 psi | ISO 178 |
| Flexural Modulus | 12.5 GPa | 1810 ksi | ISO 178 |
| Compressive Strength | 21.3 MPa | 3090 psi | 1% strain; ISO 604 |
| Charpy Impact, Notched | 0.360 J/cm² | 1.71 ft-lb/in² | ISO 179/1eA |
| Electrical Properties | Metric | English | Comments |
| Volume Resistivity | >= 1.00e+15 ohm-cm | >= 1.00e+15 ohm-cm | IEC 60093 |
| Surface Resistance | >= 1.00e+15 ohm | >= 1.00e+15 ohm | IEC 60093 |
| Dielectric Constant | 4.00 @Frequency 1.00e+6 Hz | 4.00 @Frequency 1.00e+6 Hz | IEC 60250 |
| Dielectric Strength | 37.0 kV/mm | 940 kV/in | IEC 60243-1 |
| Dissipation Factor | 0.0310 @Frequency 100 Hz | 0.0310 @Frequency 100 Hz | IEC 60250 |
| 0.0310 @Frequency 1.00e+6 Hz | 0.0310 @Frequency 1.00e+6 Hz | IEC 60250 | |
| Comparative Tracking Index | 175 V | 175 V | IEC 60112 |
| Thermal Properties | Metric | English | Comments |
| CTE, linear | 15.0 µm/m-°C | 8.33 µin/in-°F | ISO 11359-2 |
| CTE, linear, Transverse to Flow | 27.0 µm/m-°C | 15.0 µin/in-°F | ISO 11359-2 |
| Specific Heat Capacity | 1.50 J/g-°C | 0.359 BTU/lb-°F | Internal |
| Thermal Conductivity | 0.400 W/m-K | 2.78 BTU-in/hr-ft²-°F | Internal |
| Melting Point | 335 °C | 635 °F | 10°C/min; ISO 11357-1,-2,-3 |
| Deflection Temperature at 0.46 MPa (66 psi) | 300 °C | 572 °F | ISO 75-1, -2 |
| Deflection Temperature at 1.8 MPa (264 psi) | 290 °C | 554 °F | ISO 75-1, -2 |
| Flammability, UL94 | V-0 @Thickness 1.60 mm | V-0 @Thickness 0.0630 in | UL94 |
| V-0 @Thickness 0.800 mm | V-0 @Thickness 0.0315 in | UL94 | |
| Oxygen Index | 41.0 % | 41.0 % | ISO 4589 |
| Processing Properties | Metric | English | Comments |
| Processing Temperature | 20.0 - 30.0 °C | 68.0 - 86.0 °F | |
| 80.0 - 120 °C | 176 - 248 °F | Cavity temperature | |
| 270 °C | 518 °F | Ejection temperature; Internal | |
| Feed Temperature | 40.0 - 60.0 °C | 104 - 140 °F | |
| Zone 1 | 320 - 330 °C | 608 - 626 °F | |
| Zone 2 | 335 - 345 °C | 635 - 653 °F | |
| Zone 3 | 335 - 345 °C | 635 - 653 °F | |
| Zone 4 | 335 - 345 °C | 635 - 653 °F | |
| Die Temperature | 335 - 345 °C | 635 - 653 °F | |
| Melt Temperature | 335 °C | 635 °F | Optimum |
| 330 - 350 °C | 626 - 662 °F | ||
| 330 - 350 °C | 626 - 662 °F | ||
| Mold Temperature | 80.0 °C | 176 °F | Optimum |
| 40.0 - 150 °C | 104 - 302 °F | ||
| Drying Temperature | >= 150 °C | >= 302 °F | |
| Dry Time | 3.00 hour | 3.00 hour | |
| Moisture Content | 0.0100 % | 0.0100 % | Necessary low maximum residual |
| Injection Pressure | 50.0 - 150 MPa | 7250 - 21800 psi | |
| Hold Pressure | 50.0 - 150 MPa | 7250 - 21800 psi | |
| Back Pressure | 3.00 MPa | 435 psi | |