Parker Chomerics CHO-BOND® 584-29 SYRINGE-PAK™ Silver Filled Conductive Epoxy and Hardener

Parker Chomerics CHO-BOND® 584-29 SYRINGE-PAK™ Silver Filled Conductive Epoxy and Hardener 物性表: Parker Chomerics CHO-BOND® 584-29 SYRINGE-PAK™ Silver Filled Conductive Epoxy and Hardener物性表及特性介绍,Parker Chomerics CHO-BOND® 584-29 SYRINGE-PAK™ Silver Filled Conductive Epoxy and Hardener注塑参数详情,如需Parker Chomerics CHO-BOND® 584-29 SYRINGE-PAK™ Silver Filled Conductive Epoxy and Hardener下载, 可到相关下载区下载
 
Physical PropertiesMetricEnglishComments
Specific Gravity 2.20 g/cc2.20 g/ccASTM D792
 
Mechanical PropertiesMetricEnglishComments
Shear Strength >= 8.27 MPa>= 1200 psiLap; ASTM D1022
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 0.0020 ohm-cm0.0020 ohm-cmChomerics 95-40-5101 and 95-40-5102
 
Processing PropertiesMetricEnglishComments
Cure Time 15.0 min
@Temperature 113 °C
0.250 hour
@Temperature 235 °F
Shelf Life 9.00 Month
@Temperature 24.0 °C
9.00 Month
@Temperature 75.2 °F
 
Descriptive Properties
FillerAg
Mix Ratio0.069
Work Life0.5 hrs

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