Parker Chomerics CHO-BOND 1029 Conductive Adhesive

Parker Chomerics CHO-BOND 1029 Conductive Adhesive 物性表: Parker Chomerics CHO-BOND 1029 Conductive Adhesive物性表及特性介绍,Parker Chomerics CHO-BOND 1029 Conductive Adhesive注塑参数详情,如需Parker Chomerics CHO-BOND 1029 Conductive Adhesive下载, 可到相关下载区下载
 
Physical PropertiesMetricEnglishComments
Specific Gravity 2.65 - 3.35 g/cc2.65 - 3.35 g/cc
Thickness 203 microns8.00 mil
 
Mechanical PropertiesMetricEnglishComments
Shear Strength >= 3.10 MPa>= 450 psiLap
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity <= 0.060 ohm-cm<= 0.060 ohm-cmDC resistance in ohms through a 2.58 cm2 by 0.02 cm thick sample
 
Thermal PropertiesMetricEnglishComments
Maximum Service Temperature, Air 125 °C257 °F
Minimum Service Temperature, Air -55.0 °C-67.0 °F
 
Processing PropertiesMetricEnglishComments
Cure Time  30.0 min
@Temperature 121 °C
0.500 hour
@Temperature 250 °F
 10100 min
@Temperature 24.0 °C
168 hour
@Temperature 75.2 °F
Shelf Life 6.00 Month6.00 Month
 
Descriptive Properties
BinderSilicone
ConsistencyThick paste
Coverage25.5 cm2 / g
FillerAg/Cu
Mix Ratio1.0:2.5
Working Life2 hrs

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