- 密度 [g/cm3]: 1.39
- 弯曲模量 [MPa]: 7.50
Physical Properties | Metric | English | Comments | ||
---|---|---|---|---|---|
Density | 1.39 g/cc | 0.0502 lb/in³ | ISO 1183 | ||
Apparent Bulk Density | 0.600 g/cc | 0.0217 lb/in³ | ISO 60 | ||
Linear Mold Shrinkage, Flow | 0.0061 cm/cm | 0.0061 in/in | Compression molding; ISO 2577 | ||
0.0095 cm/cm | 0.0095 in/in | Injection molding; ISO 2577 | |||
Mechanical Properties | Metric | English | Comments | ||
Ball Indentation Hardness | 275 MPa | 39900 psi | H 961/30; ISO 2039/P1 | ||
Tensile Strength at Break | 55.0 MPa | 7980 psi | 5 mm/min; ISO 527 - 1/2 | ||
Tensile Modulus | 7.50 GPa | 1090 ksi | 1 mm/min; ISO 527 - 1/2 | ||
Flexural Strength | 90.0 MPa | 13100 psi | 2 mm/min; ISO 178 | ||
Flexural Modulus | 7.50 GPa | 1090 ksi | ISO 178 | ||
Compressive Strength | 225 MPa | 32600 psi | Test specimen flat tested; ISO 604 | ||
Charpy Impact Unnotched | 0.650 J/cm² @Temperature 23.0 °C | 3.09 ft-lb/in² @Temperature 73.4 °F | ISO 179-1/2 eU | ||
Charpy Impact, Notched | 0.150 J/cm² @Temperature 23.0 °C | 0.714 ft-lb/in² @Temperature 73.4 °F | ISO 179-1/2 eA | ||
Electrical Properties | Metric | English | Comments | ||
Volume Resistivity | 1.00e+11 ohm-cm | 1.00e+11 ohm-cm | IEC 60093 | ||
Surface Resistance | 1.00e+10 ohm | 1.00e+10 ohm | IEC 60093 | ||
Dielectric Constant | 10 @Frequency 100 Hz | 10 @Frequency 100 Hz | IEC 60250 | ||
Dielectric Strength | 20.0 kV/mm @Thickness 1.00 mm | 508 kV/in @Thickness 0.0394 in | IEC 60243-P1 | ||
Dissipation Factor | 0.30 @Frequency 100 Hz | 0.30 @Frequency 100 Hz | IEC 60250 | ||
Arc Resistance | 60 - 120 sec @Thickness 3.00 mm | 60 - 120 sec @Thickness 0.118 in | BK, BN | ||
Comparative Tracking Index | 125 V | 125 V | Test liquid A; IEC 60112 | ||
Hot Wire Ignition, HWI | 60 - 120 sec @Thickness 1.50 mm | 60 - 120 sec @Thickness 0.0591 in | (BN, BK) | ||
>= 120 sec @Thickness 3.00 mm | >= 120 sec @Thickness 0.118 in | BK, BN | |||
High Amp Arc Ignition, HAI | 60 - 120 arcs @Thickness 1.50 mm | 60 - 120 arcs @Thickness 0.0591 in | (BN, BK) | ||
>= 120 arcs @Thickness 3.00 mm | >= 120 arcs @Thickness 0.118 in | BK, BN | |||
High Voltage Arc-Tracking Rate, HVTR | 10.0 - 25.4 mm/min @Thickness 3.00 mm | 0.394 - 1.00 in/min @Thickness 0.118 in | BK, BN | ||
Thermal Properties | Metric | English | Comments | ||
Deflection Temperature at 8.0 MPa | 105 °C | 221 °F | ISO 75-2 | ||
UL RTI, Electrical | 150 °C @Thickness 1.50 mm | 302 °F @Thickness 0.0591 in | (BN, BK) | ||
UL RTI, Mechanical with Impact | 150 °C @Thickness 1.50 mm | 302 °F @Thickness 0.0591 in | (BN, BK) | ||
UL RTI, Mechanical without Impact | 150 °C @Thickness 1.50 mm | 302 °F @Thickness 0.0591 in | (BN, BK) | ||
Flammability, UL94 | HB @Thickness 1.50 mm | HB @Thickness 0.0591 in | (BN, BK) | ||
V-0 @Thickness 3.00 mm | V-0 @Thickness 0.118 in | BK, BN | |||
Shrinkage | 0.45 % | 0.45 % | Compression molding, 168 hours/110°C; ISO 2577 | ||
0.55 % | 0.55 % | Injection molding, 168 hours/110°C; ISO 2577 | |||
Processing Properties | Metric | English | Comments | ||
Feed Temperature | 60.0 - 75.0 °C | 140 - 167 °F | Injection molding | ||
Nozzle Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding | ||
Melt Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding | ||
Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding | ||
160 - 190 °C | 320 - 374 °F | Compression molding | |||
Injection Pressure | >= 15.0 MPa | >= 2180 psi | Compression and injection cavity mold pressure | ||
Back Pressure | 0.500 - 2.00 MPa | 72.5 - 290 psi | Injection molding | ||
Cure Time | 0.167 - 0.333 min | 0.00278 - 0.00556 hour | Per 1 mm of wall thickness, injection molding | ||
0.333 - 0.667 min | 0.00556 - 0.0111 hour | Per 1 mm of wall thickness, compression molding | |||
Descriptive Properties | |||||
Chromatic Spectrum | Subdued Colors | ||||
Creep Rupture Strength | Good | ||||
Holding Pressure | Approximately 40-60% of injection pressure | ||||
Media Resistance | Good | ||||
Moisture Absorption | 75 mg | ISO 62, 24 hours at 23°C | |||
Reserves by Peak Temperature | High | ||||
Thermal Expansion | Slight |