- 密度 [g/cm3]: 1.7
- 弯曲模量 [MPa]: 11.0
Physical Properties | Metric | English | Comments | ||
---|---|---|---|---|---|
Bulk Density | 0.700 - 0.850 g/cc | 0.0253 - 0.0307 lb/in³ | Powder Density; ISO 60 | ||
Density | 1.70 g/cc | 0.0614 lb/in³ | Relative Density; ISO 1183 | ||
Linear Mold Shrinkage | 0.0030 - 0.0060 cm/cm | 0.0030 - 0.0060 in/in | Injection Molding; ISO 2577 | ||
Mechanical Properties | Metric | English | Comments | ||
Tensile Strength at Break | 60.0 - 85.0 MPa | 8700 - 12300 psi | ISO 527 | ||
Elongation at Break | 0.60 - 0.70 % | 0.60 - 0.70 % | Tensile; ISO 527 | ||
1.3 - 1.5 % | 1.3 - 1.5 % | Flexure; ISO 178 | |||
Tensile Modulus | 12.5 - 14.5 GPa | 1810 - 2100 ksi | ISO 527 | ||
Flexural Strength | 140 - 180 MPa | 20300 - 26100 psi | At Rupture; ISO 178 | ||
Flexural Modulus | 11.0 - 14.0 GPa | 1600 - 2030 ksi | ISO 178 | ||
Compressive Strength | 240 - 280 MPa | 34800 - 40600 psi | ISO 604 | ||
Charpy Impact Unnotched | 0.800 - 1.10 J/cm² | 3.81 - 5.24 ft-lb/in² | ISO 179 | ||
Charpy Impact, Notched | 0.250 - 0.400 J/cm² | 1.19 - 1.90 ft-lb/in² | ISO 179 | ||
Electrical Properties | Metric | English | Comments | ||
Insulation Resistance | 1.00e+9 - 1.00e+11 ohm | 1.00e+9 - 1.00e+11 ohm | Dry; IEC 167 | ||
Dielectric Strength | 25.0 kV/mm | 635 kV/in | IEC 243 | ||
Comparative Tracking Index | 125 V | 125 V | IEC 112 | ||
Thermal Properties | Metric | English | Comments | ||
CTE, linear, Parallel to Flow | 20.0 - 30.0 µm/m-°C @Temperature 20.0 °C | 11.1 - 16.7 µin/in-°F @Temperature 68.0 °F | TMA | ||
CTE, linear, Transverse to Flow | 40.0 - 50.0 µm/m-°C @Temperature 20.0 °C | 22.2 - 27.8 µin/in-°F @Temperature 68.0 °F | TMA | ||
Deflection Temperature at 1.8 MPa (264 psi) | 170 - 180 °C | 338 - 356 °F | ISO 75 Af | ||
Flammability, UL94 | V-1 @Thickness 1.60 mm | V-1 @Thickness 0.0630 in | |||
V-0 @Thickness 4.00 mm | V-0 @Thickness 0.157 in | ||||
Shrinkage | 0.050 - 0.15 % | 0.050 - 0.15 % | Post Shrinkage; ISO 2577 | ||
Descriptive Properties | |||||
Color | Black, Green | ||||
ISO type | PF 2 C1 | ||||
Main Filler | Glass Fiber, Glass Bead, Graphite | ||||
Molding Method | Compression, transfer, injection |