- 密度 [g/cm3]: 1.6
- 弯曲模量 [MPa]: 9.50
Physical Properties | Metric | English | Comments | ||
---|---|---|---|---|---|
Bulk Density | 0.700 g/cc | 0.0253 lb/in³ | Powder Density; ISO 60 | ||
Density | 1.60 g/cc | 0.0578 lb/in³ | Relative Density; ISO 1183 | ||
Linear Mold Shrinkage | 0.0090 cm/cm | 0.0090 in/in | Injection Molding; ISO 2577 | ||
Mechanical Properties | Metric | English | Comments | ||
Tensile Strength at Break | 50.0 MPa | 7250 psi | ISO 527 | ||
Elongation at Break | 0.60 % | 0.60 % | Tensile; ISO 527 | ||
1.5 % | 1.5 % | Flexure; ISO 178 | |||
Tensile Modulus | 10.0 GPa | 1450 ksi | ISO 527 | ||
Flexural Strength | 95.0 MPa | 13800 psi | At Rupture; ISO 178 | ||
Flexural Modulus | 9.50 GPa | 1380 ksi | ISO 178 | ||
Compressive Strength | 200 MPa | 29000 psi | ISO 604 | ||
Charpy Impact Unnotched | 0.700 J/cm² | 3.33 ft-lb/in² | ISO 179 | ||
Charpy Impact, Notched | 0.200 J/cm² | 0.952 ft-lb/in² | ISO 179 | ||
Electrical Properties | Metric | English | Comments | ||
Volume Resistivity | 1.00e+14 ohm-cm | 1.00e+14 ohm-cm | DIN 53482 | ||
Surface Resistance | 1.00e+12 ohm | 1.00e+12 ohm | IEC 93 | ||
Insulation Resistance | 1.00e+10 ohm | 1.00e+10 ohm | Dry; IEC 167 | ||
1.00e+10 ohm | 1.00e+10 ohm | Wet; 24 hours in water; IEC 167 | |||
Dielectric Strength | 25.0 kV/mm | 635 kV/in | IEC 243 | ||
Comparative Tracking Index | 175 V | 175 V | IEC 112 | ||
Thermal Properties | Metric | English | Comments | ||
CTE, linear, Parallel to Flow | 50.0 µm/m-°C @Temperature 20.0 °C | 27.8 µin/in-°F @Temperature 68.0 °F | TMA | ||
CTE, linear, Transverse to Flow | 60.0 µm/m-°C @Temperature 20.0 °C | 33.3 µin/in-°F @Temperature 68.0 °F | TMA | ||
Deflection Temperature at 1.8 MPa (264 psi) | 175 °C | 347 °F | ISO 75 Af | ||
Flammability, UL94 | V-1 @Thickness 1.60 mm | V-1 @Thickness 0.0630 in | |||
V-0 @Thickness 4.00 mm | V-0 @Thickness 0.157 in | ||||
Shrinkage | 0.35 % | 0.35 % | Post Shrinkage; ISO 2577 | ||
Descriptive Properties | |||||
Color | Black | ||||
ISO type | PF 2 C3 | ||||
Main Filler | Organic & Inorganic | ||||
Molding Method | Compression, transfer, injection |