- 密度 [g/cm3]: 1.6
- 吸水率 [%]: 0.16
| Physical Properties | Metric | English | Comments | ||
|---|---|---|---|---|---|
| Density | 1.60 g/cc | 0.0578 lb/in³ | ASTM D792 Method A | ||
| Water Absorption | 0.16 % | 0.16 % | IPC TM-650 2.6.2.1 | ||
| Mechanical Properties | Metric | English | Comments | ||
| Tensile Strength | 241 MPa | 35000 psi | IPC TM-650 2.4.18.3 | ||
| Modulus of Elasticity | 27.6 GPa | 4000 ksi | IPC TM-650 2.4.18.3 | ||
| Flexural Strength | 400 MPa | 58000 psi | crosswise; IPC TM-650 2.4.4 | ||
| 496 MPa | 72000 psi | lengthwise; IPC TM-650 2.4.4 | |||
| Poissons Ratio | 0.19 | 0.19 | y; ASTM D3039 | ||
| 0.21 | 0.21 | x; ASTM D3039 | |||
| Peel Strength | 1.40 kN/m | 8.00 pli | To Copper (1 oz./35 micron); At Elevated Temperatures; IPC TM-650 2.4.8.2 | ||
| 1.47 kN/m | 8.40 pli | To Copper (1 oz./35 micron); After Process Solutions; IPC TM-650 2.4.8 | |||
| 1.49 kN/m | 8.50 pli | To Copper (1 oz./35 micron); After Thermal Stress; IPC TM-650 2.4.8 | |||
| Electrical Properties | Metric | English | Comments | ||
| Volume Resistivity | 2.80e+14 ohm-cm | 2.80e+14 ohm-cm | C96/35/90; IPC TM-650 2.5.17.1 | ||
| 3.90e+14 ohm-cm | 3.90e+14 ohm-cm | E24/125; IPC TM-650 2.5.17.1 | |||
| Surface Resistance | 1.20e+14 ohm | 1.20e+14 ohm | C96/35/90; IPC TM-650 2.5.17.1 | ||
| 1.30e+14 ohm | 1.30e+14 ohm | E24/125; IPC TM-650 2.5.17.1 | |||
| Dielectric Constant | 4.2 @Frequency 1.00e+6 Hz | 4.2 @Frequency 1.00e+6 Hz | May vary with resin %; IPC TM-650 2.5.5.3 | ||
| Dielectric Strength | 55.1 kV/mm | 1400 kV/in | IPC TM-650 2.5.6.2 | ||
| Dielectric Breakdown | 65000 V | 65000 V | IPC TM-650 2.5.6 | ||
| Dissipation Factor | 0.0060 @Frequency 1.00e+6 Hz | 0.0060 @Frequency 1.00e+6 Hz | IPC TM-650 2.5.5.3 | ||
| Arc Resistance | >= 120 sec | >= 120 sec | IPC TM-650 2.5.1 | ||
| Thermal Properties | Metric | English | Comments | ||
| CTE, linear | 13.0 - 14.0 µm/m-°C | 7.22 - 7.78 µin/in-°F | x ,y direction; IPC TM-650 2.4.41 | ||
| CTE, linear, Transverse to Flow | 25.0 µm/m-°C @Temperature <=250 °C | 13.9 µin/in-°F @Temperature <=482 °F | z (< Tg); IPC TM-650 2.4.24 | ||
| 150 µm/m-°C @Temperature >=250 °C | 83.3 µin/in-°F @Temperature >=482 °F | z (> Tg); IPC TM-650 2.4.24 | |||
| Thermal Conductivity | 0.450 W/m-K | 3.12 BTU-in/hr-ft²-°F | ASTM E1461 | ||
| Glass Transition Temp, Tg | 250 °C | 482 °F | TMA; IPC TM-650 2.4.24 | ||
| Decomposition Temperature | 363 °C | 685 °F | Onset; IPC TM-650 2.3.41 | ||
| 424 °C | 795 °F | 5 percent; IPC TM-650 2.3.41 | |||
| Flammability, UL94 | V-0 | V-0 | |||
| Descriptive Properties | |||||
| IPC Delamination - T260 (minutes) | > 60 | IPC TM-650 2.4.24.1 | |||
| IPC Delamination - T288 (minutes) | 15 | IPC TM-650 2.4.24.1 | |||
| IPC Delamination - T300 (minutes) | 10 | IPC TM-650 2.4.24.1 | |||
| Z-Axis Expansion (%) | 0.65 | IPC TM-650 2.4.24 (50-260°C) | |||