- 密度 [g/cm3]: 1.45
- 吸水率 [%]: 0.08
- 弯曲模量 [MPa]: 4.10
- 热变形温度 [℃]: 210.0
Physical Properties | Metric | English | Comments |
---|---|---|---|
Density | 1.45 g/cc | 0.0524 lb/in³ | ASTM D792 |
Water Absorption | 0.080 % | 0.080 % | 24 hr; ASTM D570 |
Linear Mold Shrinkage | 0.0060 - 0.010 cm/cm | 0.0060 - 0.010 in/in | ASTM D955 |
Mechanical Properties | Metric | English | Comments |
Tensile Strength at Break | 90.0 MPa | 13100 psi | ASTM D638 |
Elongation at Break | 6.0 % | 6.0 % | ASTM D638 |
Flexural Strength | 160 MPa | 23200 psi | ASTM D790 |
Flexural Modulus | 4.10 GPa | 595 ksi | ASTM D790 |
Charpy Impact Unnotched | 3.50 J/cm² | 16.7 ft-lb/in² | ISO179 |
Charpy Impact, Notched | 0.800 J/cm² | 3.81 ft-lb/in² | ISO179 |
Electrical Properties | Metric | English | Comments |
Volume Resistivity | 1.00e+16 ohm-cm | 1.00e+16 ohm-cm | ASTM D257 |
Dielectric Constant | 3.0 @Frequency 1e+6 Hz | 3.0 @Frequency 1e+6 Hz | ASTM D150 |
Dielectric Strength | 22.0 kV/mm @Thickness 2.00 mm | 559 kV/in @Thickness 0.0787 in | ASTM D149 |
Dissipation Factor | 0.019 @Frequency 1e+6 Hz | 0.019 @Frequency 1e+6 Hz | ASTM D150 |
Comparative Tracking Index | 250 V @Thickness 3.20 mm | 250 V @Thickness 0.126 in | ASTM D3638 |
Thermal Properties | Metric | English | Comments |
CTE, linear | 55.0 µm/m-°C @Temperature -30.0 - 30.0 °C | 30.6 µin/in-°F @Temperature -22.0 - 86.0 °F | ASTM D696 |
Deflection Temperature at 0.46 MPa (66 psi) | 210 °C | 410 °F | ASTM D648 |
Deflection Temperature at 1.8 MPa (264 psi) | 190 °C | 374 °F | ASTM D648 |
Flammability, UL94 | V-0 @Thickness 3.20 mm | V-0 @Thickness 0.126 in | |
Processing Properties | Metric | English | Comments |
Middle Barrel Temperature | 225 - 255 °C | 437 - 491 °F | |
Nozzle Temperature | 245 °C | 473 °F | |
Mold Temperature | 40.0 - 80.0 °C | 104 - 176 °F | |
Drying Temperature | 130 °C | 266 °F | |
Dry Time | 4 hour | 4 hour | |
Injection Pressure | 80.0 - 120 MPa | 11600 - 17400 psi | |
Back Pressure | 8.00 - 18.0 MPa | 1160 - 2610 psi | |
Screw Speed | <= 100 rpm | <= 100 rpm |