| Physical Properties | Metric | English | Comments | ||
|---|---|---|---|---|---|
| Specific Gravity | 1.38 - 1.42 g/cc | 1.38 - 1.42 g/cc | PEPL-10-W-21 | ||
| Bulk Density | 0.800 g/cc | 0.0289 lb/in³ | PEPL-10-W-67 | ||
| Bead Size | 2.80 mm | 0.110 in | chip size, length; PEPL-10-W-71 | ||
| 3.10 mm | 0.122 in | chip size, D2; PEPL-10-W-71 | |||
| 3.80 mm | 0.150 in | chip size, D1; PEPL-10-W-71 | |||
| Viscosity Measurement | 0.70 - 0.74 | 0.70 - 0.74 | intrinsic, [dl/gm]; QCD--W1-42 | ||
| Thermal Properties | Metric | English | Comments | ||
| Heat of Fusion | <= 65.0 J/g | <= 28.0 BTU/lb | |||
| Specific Heat Capacity | 1.10 J/g-°C @Temperature 20.0 °C | 0.263 BTU/lb-°F @Temperature 68.0 °F | |||
| 1.37 J/g-°C @Temperature 80.0 °C | 0.327 BTU/lb-°F @Temperature 176 °F | ||||
| 1.44 J/g-°C @Temperature 100 °C | 0.344 BTU/lb-°F @Temperature 212 °F | ||||
| 1.82 J/g-°C @Temperature 200 °C | 0.435 BTU/lb-°F @Temperature 392 °F | ||||
| 2.05 J/g-°C @Temperature 280 °C | 0.490 BTU/lb-°F @Temperature 536 °F | ||||
| Thermal Conductivity | 0.213 W/m-K @Temperature 280 °C | 1.48 BTU-in/hr-ft²-°F @Temperature 536 °F | liquid | ||
| 0.242 W/m-K @Temperature 20.0 °C | 1.68 BTU-in/hr-ft²-°F @Temperature 68.0 °F | solid | |||
| Melting Point | 250 - 256 °C | 482 - 493 °F | QCD--W1-49 | ||
| Glass Transition Temp, Tg | 77.0 - 81.0 °C | 171 - 178 °F | QCD--W1-21 | ||
| Flash Point | 480 °C | 896 °F | |||
| Oxygen Index | >= 30 % | >= 30 % | ASTM D 2863 | ||
| Processing Properties | Metric | English | Comments | ||
| Moisture Content | <= 0.20 % | <= 0.20 % | when packed; QCD--W1-54 | ||
| Descriptive Properties | |||||
| Acetaldehydes (ppm) | <1 | QCD--W1-53 | |||
| Chips per Gram | 30-36 | QCD--W1-47 | |||
| COOH end groups (mval/kg) | <25 | QCD--W1-43 | |||
| Fines (ppm) | <100 | QCD--W156 | |||
