- 熔体流动速率 [g/10min]: 0.7
- 密度 [g/cm3]: 0.92
- 弯曲模量 [MPa]: 0.400
- 脆化温度 [℃]: -76.0
| Physical Properties | Metric | English | Comments | ||
|---|---|---|---|---|---|
| Density | 0.920 g/cc | 0.0332 lb/in³ | base resin; ISO 1872-2/ISO 1183 | ||
| Environmental Stress Crack Resistance | >= 5.0 hour @Temperature 50.0 °C | >= 5.0 hour @Temperature 122 °F | Igepal 10%, F0; IEC 60811-4-1/B | ||
| Melt Flow | 0.70 g/10 min @Load 2.16 kg, Temperature 190 °C | 0.70 g/10 min @Load 4.76 lb, Temperature 374 °F | ISO 1133 | ||
| Mechanical Properties | Metric | English | Comments | ||
| Hardness, Shore D | 50 | 50 | 3s; ISO 868 | ||
| 52 | 52 | 1s; ISO 868 | |||
| Tensile Strength at Break | 28.0 MPa | 4060 psi | 50mm/min; ISO 527 | ||
| Elongation at Break | 800 % | 800 % | 50mm/min; ISO 527 | ||
| Flexural Modulus | 0.400 GPa | 58.0 ksi | ASTM D790 | ||
| Electrical Properties | Metric | English | Comments | ||
| Volume Resistivity | 1.00e+6 ohm-cm | 1.00e+6 ohm-cm | DC; IEC 60093 | ||
| Dielectric Constant | 2.3 @Frequency 1.00e+6 Hz | 2.3 @Frequency 1.00e+6 Hz | IEC 60250 | ||
| Dielectric Strength | <= 20.0 kV/mm | <= 508 kV/in | IEC 60243 | ||
| Dissipation Factor | 0.00015 @Frequency 1.00e+6 Hz | 0.00015 @Frequency 1.00e+6 Hz | IEC 60250 | ||
| Thermal Properties | Metric | English | Comments | ||
| Brittleness Temperature | <= -76.0 °C | <= -105 °F | ASTM D746 | ||
| Processing Properties | Metric | English | Comments | ||
| Processing Temperature | 90.0 °C | 194 °F | preheating temperature | ||
| 90.0 °C | 194 °F | drying temperature | |||
| 150 °C | 302 °F | feed section | |||
| Middle Barrel Temperature | 170 °C | 338 °F | metering section | ||
| Head Temperature | 190 °C | 374 °F | die head | ||
| Descriptive Properties | |||||
| High Temperature Pressure Test, % | < 15% | 115°C; 6 hours; IEC 60811-3-1 | |||