DuPont™ Tefzel® HT-2160 Static Dissipating Semiconductive Resin

DuPont™ Tefzel® HT-2160 Static Dissipating Semiconductive Resin 物性表: DuPont™ Tefzel® HT-2160 Static Dissipating Semiconductive Resin物性表及特性介绍,DuPont™ Tefzel® HT-2160 Static Dissipating Semiconductive Resin注塑参数详情,如需DuPont™ Tefzel® HT-2160 Static Dissipating Semiconductive Resin下载, 可到相关下载区下载
  • 弯曲强度 [MPa]: 34.47
 
Physical PropertiesMetricEnglishComments
Specific Gravity 1.70 g/cc1.70 g/ccASTM D792
 
Mechanical PropertiesMetricEnglishComments
Tensile Strength, Ultimate 34.47 MPa4999 psiASTM D3159
Elongation at Break 200 %200 %ASTM D3159
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 7.0 ohm-cm7.0 ohm-cmmeasured on compression molded plaques. Resistivity is very sensitive to processing techniques; ASTM D257
 
Thermal PropertiesMetricEnglishComments
Melting Point 255 - 280 °C491 - 536 °FASTM D3159
Maximum Service Temperature, Air 150 °C302 °F
 
Descriptive Properties
Chemical/Solvent ResistanceExcellent
Weather ResistanceExcellentYears unaffected in Florida Exposure

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