- 密度 [g/cm3]: 2.3
- 吸水率 [%]: 0.05
| Physical Properties | Metric | English | Comments | ||
|---|---|---|---|---|---|
| Density | 2.30 g/cc | 0.0831 lb/in³ | ASTM D792 Method A | ||
| Water Absorption | 0.050 % | 0.050 % | IPC TM-650 2.6.2.1 | ||
| Outgassing - Total Mass Loss | 0.010 % @Pressure <=1.33e-10 MPa, Temperature 125 °C | 0.010 % @Pressure <=1.93e-8 psi, Temperature 257 °F | Collected Volatiles; NASA SP-R-0022A | ||
| 0.010 % @Pressure <=1.33e-10 MPa, Temperature 125 °C | 0.010 % @Pressure <=1.93e-8 psi, Temperature 257 °F | Water Vapor Recovered; NASA SP-R-0022A | |||
| 0.020 % @Pressure <=1.33e-10 MPa, Temperature 125 °C | 0.020 % @Pressure <=1.93e-8 psi, Temperature 257 °F | NASA SP-R-0022A | |||
| Mechanical Properties | Metric | English | Comments | ||
| Tensile Strength | 55.2 MPa | 8000 psi | Cross; IPC TM-650 2.4.18.3 | ||
| 75.8 MPa | 11000 psi | Machine; IPC TM-650 2.4.18.3 | |||
| Flexural Strength | 68.9 MPa | 10000 psi | Cross; IPC TM-650 2.4.4 | ||
| 96.5 MPa | 14000 psi | Machine; IPC TM-650 2.4.4 | |||
| Peel Strength | 1.23 kN/m | 7.00 pli | To Copper (1 oz./35 micron); After Process Solutions; IPC TM-650 2.4.8 | ||
| 1.23 kN/m | 7.00 pli | To Copper (1 oz./35 micron); After Thermal Stress; IPC TM-650 2.4.8 | |||
| 1.58 kN/m | 9.00 pli | To Copper (1 oz./35 micron); At Elevated Temperatures; IPC TM-650 2.4.8.2 | |||
| Electrical Properties | Metric | English | Comments | ||
| Volume Resistivity | 7.40e+12 ohm-cm | 7.40e+12 ohm-cm | C96/35/90; IPC TM-650 2.5.17.1 | ||
| 1.40e+14 ohm-cm | 1.40e+14 ohm-cm | E24/125; IPC TM-650 2.5.17.1 | |||
| Surface Resistance | 3.20e+14 ohm | 3.20e+14 ohm | C96/35/90; IPC TM-650 2.5.17.1 | ||
| 4.30e+14 ohm | 4.30e+14 ohm | E24/125; IPC TM-650 2.5.17.1 | |||
| Dielectric Constant | 3.5 @Frequency 1.00e+6 Hz | 3.5 @Frequency 1.00e+6 Hz | may vary by thickness; IPC TM-650 2.5.5.3 | ||
| 3.5 @Frequency 1.00e+10 Hz | 3.5 @Frequency 1.00e+10 Hz | may vary by thickness; IPC TM-650 2.5.5.5 | |||
| 3.5 @Frequency 1.80e+9 Hz | 3.5 @Frequency 1.80e+9 Hz | may vary by thickness; Resonant Cavity | |||
| Dielectric Strength | 30.7 kV/mm | 780 kV/in | IPC TM-650 2.5.6.2 | ||
| Dielectric Breakdown | 40000 V | 40000 V | IPC TM-650 2.5.6 | ||
| Dissipation Factor | 0.0015 @Frequency 1.00e+6 Hz | 0.0015 @Frequency 1.00e+6 Hz | may vary by thickness; IPC TM-650 2.5.5.3 | ||
| 0.0018 @Frequency 1.80e+9 Hz | 0.0018 @Frequency 1.80e+9 Hz | may vary by thickness; Resonant Cavity | |||
| 0.0020 @Frequency 1.00e+10 Hz | 0.0020 @Frequency 1.00e+10 Hz | may vary by thickness; IPC TM-650 2.5.5.5 | |||
| Arc Resistance | >= 240 sec | >= 240 sec | IPC TM-650 2.5.1 | ||
| Thermal Properties | Metric | English | Comments | ||
| CTE, linear | 7.00 µm/m-°C @Temperature 50.0 - 150 °C | 3.89 µin/in-°F @Temperature 122 - 302 °F | IPC TM-650 2.4.41 | ||
| CTE, linear, Transverse to Flow | 23.0 µm/m-°C @Temperature 50.0 - 150 °C | 12.8 µin/in-°F @Temperature 122 - 302 °F | z direction; IPC TM-650 2.4.24 | ||
| Specific Heat Capacity | 0.900 J/g-°C | 0.215 BTU/lb-°F | ASTM E1461 | ||
| Thermal Conductivity | 1.00 W/m-K | 6.94 BTU-in/hr-ft²-°F | ASTM D5470 | ||
| Decomposition Temperature | 520 °C | 968 °F | Initial; IPC TM-650 2.4.24.6 | ||
| 567 °C | 1050 °F | 5 percent; IPC TM-650 2.4.24.6 | |||
| Flammability, UL94 | V-0 | V-0 | |||
| Descriptive Properties | |||||
| IPC Delamination - T260 (minutes) | > 60 | IPC TM-650 2.4.24.1 | |||
| IPC Delamination - T288 (minutes) | > 60 | IPC TM-650 2.4.24.1 | |||
| IPC Delamination - T300 (minutes) | > 60 | IPC TM-650 2.4.24.1 | |||
| Temperature Coefficient of Dielectric (ppm/°C) | -9 | IPC TM-650 2.5.5.5; at 10 GHz (-40 - 150°C) | |||
| Z-Axis Expansion (%) | 1.2 | IPC TM-650 2.4.24 (50-260°C) | |||