- 密度 [g/cm3]: 1.14
- 吸水率 [%]: 8.5
- 拉伸强度 [MPa]: 60.0
Physical Properties | Metric | English | Comments | ||
---|---|---|---|---|---|
Density | 1.14 g/cc | 0.0412 lb/in³ | (DAM); ISO 1183 | ||
Water Absorption | 8.5 % | 8.5 % | DAM; Sim. to ISO 62 | ||
Moisture Absorption at Equilibrium | 2.3 % | 2.3 % | Humidity Absorption (DAM); Sim. to ISO 62 | ||
Linear Mold Shrinkage, Flow | 0.0095 cm/cm | 0.0095 in/in | DAM; ISO 294-4 | ||
0.0095 cm/cm | 0.0095 in/in | DAM; ISO 294-4 | |||
Mechanical Properties | Metric | English | Comments | ||
Tensile Strength, Yield | 60.0 MPa | 8700 psi | ISO 527-1/-2 | ||
Elongation at Break | >= 50 % | >= 50 % | ISO 527-1/-2 | ||
Elongation at Yield | 20 % | 20 % | ISO 527-1/-2 | ||
Tensile Modulus | 1.50 GPa | 218 ksi | ISO 527-1/-2 | ||
Charpy Impact Unnotched | NB @Temperature -30.0 °C | NB @Temperature -22.0 °F | ISO 179/1eU | ||
NB @Temperature 23.0 °C | NB @Temperature 73.4 °F | ISO 179/1eU | |||
Charpy Impact, Notched | 0.600 J/cm² @Temperature -30.0 °C | 2.86 ft-lb/in² @Temperature -22.0 °F | ISO 179/1eA | ||
1.20 J/cm² @Temperature 23.0 °C | 5.71 ft-lb/in² @Temperature 73.4 °F | ISO 179/1eA | |||
Tensile Creep Modulus, 1 hour | 3400 MPa | 493000 psi | ISO 899-1 | ||
Electrical Properties | Metric | English | Comments | ||
Volume Resistivity | 1.00e+12 ohm-cm | 1.00e+12 ohm-cm | IEC 60093 | ||
Surface Resistance | 1.00e+14 ohm | 1.00e+14 ohm | IEC 60093 | ||
Dielectric Constant | 4.3 @Frequency 1e+6 Hz | 4.3 @Frequency 1e+6 Hz | IEC 60250 | ||
15 @Frequency 100 Hz | 15 @Frequency 100 Hz | IEC 60250 | |||
Dielectric Strength | 25.0 kV/mm | 635 kV/in | IEC 60243-1 | ||
Dissipation Factor | 0.12 @Frequency 1e+6 Hz | 0.12 @Frequency 1e+6 Hz | IEC 60250 | ||
0.24 @Frequency 100 Hz | 0.24 @Frequency 100 Hz | IEC 60250 | |||
Comparative Tracking Index | 600 V | 600 V | IEC 60112 | ||
Thermal Properties | Metric | English | Comments | ||
Melting Point | 260 °C | 500 °F | 10°C/min (DAM); ISO 11357-1/-3 | ||
Descriptive Properties | |||||
Heat Stabilized or Stable to Heat | Yes | ||||
Injection Molding | Yes | ||||
Release Agent | Yes | ||||
Without Fillers | Yes |