颗粒图：
物性表:
| Physical Properties | Metric | English | Comments | ||
|---|---|---|---|---|---|
| Density | 1.08 g/cc | 0.0390 lb/in³ | ISO 1183 | ||
| Water Absorption | 1.05 % @Temperature 23.0 °C, Time 86400 sec |
1.05 % @Temperature 73.4 °F, Time 24.0 hour |
ISO 62 | ||
| Linear Mold Shrinkage, Flow | 0.019 cm/cm | 0.019 in/in | |||
| Linear Mold Shrinkage, Transverse | 0.019 cm/cm | 0.019 in/in | |||
| Mechanical Properties | Metric | English | Comments | ||
| Hardness, Rockwell R | 115 | 115 | ASTM D786 | ||
| Tensile Strength, Yield | 50.0 MPa | 7250 psi | ASTM D638 | ||
| Izod Impact, Notched | 9.50 J/cm | 17.8 ft-lb/in | ASTM D265 | ||
| Electrical Properties | Metric | English | Comments | ||
| Volume Resistivity | 1.00e+14 ohm-cm | 1.00e+14 ohm-cm | IEC 60093 | ||
| Surface Resistance | 1.00e+13 ohm | 1.00e+13 ohm | IEC 60093 | ||
| Dielectric Constant | 3.2 | 3.2 | IEC60250 | ||
| Dielectric Strength | 30.0 kV/mm | 762 kV/in | IEC 60243 | ||
| Dissipation Factor | 0.020 | 0.020 | IEC 60250 | ||
| Comparative Tracking Index | 450 V | 450 V | Solution B; IEC 60112 | ||
| 575 V | 575 V | Solution A; IEC 60112 | |||
| Thermal Properties | Metric | English | Comments | ||
| CTE, linear | 12.6 µm/m-°C @Temperature 23.0 - 85.0 °C |
7.00 µin/in-°F @Temperature 73.4 - 185 °F |
ASTM D696 | ||
| Melting Point | 262 °C | 504 °F | ISO 11357 | ||
| Deflection Temperature at 0.46 MPa (66 psi) | 222 °C | 432 °F | ASTM D648 | ||
| Deflection Temperature at 1.8 MPa (264 psi) | 70.0 °C | 158 °F | ASTM D648 | ||
| Flammability, UL94 | HB @Thickness 3.20 mm |
HB @Thickness 0.126 in |
ISO 1210 | ||
| Oxygen Index | 24.5 % | 24.5 % | ISO 4589 | ||
| Processing Properties | Metric | English | Comments | ||
| Feed Temperature | 265 - 270 °C | 509 - 518 °F | |||
| Front Barrel Temperature | 280 - 290 °C | 536 - 554 °F | |||
| Mold Temperature | 60.0 - 80.0 °C | 140 - 176 °F | |||
| Drying Temperature | 80.0 °C | 176 °F | |||
| Moisture Content | <= 0.20 % | <= 0.20 % | |||
| De |
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| Compression Zone | 270-280°C | ||||
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