Evonik Corporation Plexiglas® hw55 Clear Molding Compound

Evonik Corporation Plexiglas® hw55 Clear Molding Compound 物性表: Evonik Corporation Plexiglas® hw55 Clear Molding Compound物性表及特性介绍,Evonik Corporation Plexiglas® hw55 Clear Molding Compound注塑参数详情,如需Evonik Corporation Plexiglas® hw55 Clear Molding Compound下载, 可到相关下载区下载
  • 熔体流动速率 [g/10min]: 1.428
  • 密度 [g/cm3]: 1.19
  • 吸水率 [%]: 2.2
  • 热变形温度 [℃]: 109.0
  • 透光率 [%]: 90.0
 
Physical PropertiesMetricEnglishComments
Density 1.19 g/cc0.0430 lb/in³ISO 1183
Moisture Absorption at Equilibrium 0.60 %0.60 %Humidity Absorption (23°C, 50%); ISO 62
Water Absorption at Saturation 2.2 %2.2 %Water Absorption in Water; ISO 62
Melt Flow 1.428 g/10 min
@Load 3.80 kg,
Temperature 230 °C
1.428 g/10 min
@Load 8.38 lb,
Temperature 446 °F
ISO 1133
 
Mechanical PropertiesMetricEnglishComments
Tensile Strength at Break 80.0 MPa11600 psi5 mm/min; ISO 527
Elongation at Break 3.5 %3.5 %5 mm/min; ISO 527
Tensile Modulus 3.60 GPa522 ksi1 mm/min; ISO 527
Charpy Impact Unnotched 2.00 J/cm²
@Temperature 23.0 °C
9.52 ft-lb/in²
@Temperature 73.4 °F
ISO 179
 
Thermal PropertiesMetricEnglishComments
CTE, linear 70.0 µm/m-°C
@Temperature 0.000 - 50.0 °C
38.9 µin/in-°F
@Temperature 32.0 - 122 °F
ASTM E831
Deflection Temperature at 0.46 MPa (66 psi) 109 °C228 °FISO 75
Deflection Temperature at 1.8 MPa (264 psi) 106 °C223 °FISO 75
Vicat Softening Point 119 °C246 °FB50; ISO 306
Glass Transition Temp, Tg 122 °C252 °FIEC 10006
Flammability, UL94 HB
@Thickness 1.60 mm
HB
@Thickness 0.0630 in
IEC 707
 
Optical PropertiesMetricEnglishComments
Refractive Index 1.511.51ISO 489
Transmission, Visible 90 %90 %Transmission Factor; DIN 5036
 
Processing PropertiesMetricEnglishComments
Processing Temperature 220 - 250 °C428 - 482 °FCylinder Temperature
Melt Temperature 220 - 250 °C428 - 482 °F
Mold Temperature 60.0 - 90.0 °C140 - 194 °F
Drying Temperature <= 109 °C<= 228 °FPredrying
Dry Time 2 - 3 hour2 - 3 hourDesiccant-type drier

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