Aptek 6106-A/B Epoxy Encapsulant and/or Potting Compound

Aptek 6106-A/B Epoxy Encapsulant and/or Potting Compound 物性表: Aptek 6106-A/B Epoxy Encapsulant and/or Potting Compound物性表及特性介绍,Aptek 6106-A/B Epoxy Encapsulant and/or Potting Compound注塑参数详情,如需Aptek 6106-A/B Epoxy Encapsulant and/or Potting Compound下载, 可到相关下载区下载
  • 密度 [g/cm3]: 0.95
 
Physical PropertiesMetricEnglishComments
Density 0.950 g/cc0.0343 lb/in³B Component; ASTM D1475
 1.16 g/cc0.0419 lb/in³A Component; ASTM D1475
Viscosity 25 cP25 cPB Component; Spindle #1; speed 100 rpm; ASTM D1824
 2000 cP2000 cPA Component; Spindle #3; speed 10 rpm; ASTM D1824
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore D 8585Cured property; ASTM D2240
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity >= 1.00e+15 ohm-cm>= 1.00e+15 ohm-cmCured property; ASTM D257
 
Thermal PropertiesMetricEnglishComments
CTE, linear  79.0 µm/m-°C
@Temperature 20.0 °C
43.9 µin/in-°F
@Temperature 68.0 °F
Cured property; alpha 1; Perkin Elmer TMS-2
 175 µm/m-°C
@Temperature 20.0 °C
97.2 µin/in-°F
@Temperature 68.0 °F
Cured property; alpha 2; Perkin Elmer TMS-2
Glass Transition Temp, Tg >= 135 °C>= 275 °FCured property; Perkin Elmer TMS-2
Flash Point >= 100 °C>= 212 °FB Component; ASTM D92
 >= 200 °C>= 392 °FA Component; ASTM D92

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