Aptek 6103-A/B Epoxy Encapsulant

Aptek 6103-A/B Epoxy Encapsulant 物性表: Aptek 6103-A/B Epoxy Encapsulant物性表及特性介绍,Aptek 6103-A/B Epoxy Encapsulant注塑参数详情,如需Aptek 6103-A/B Epoxy Encapsulant下载, 可到相关下载区下载
  • 密度 [g/cm3]: 1.16
 
Physical PropertiesMetricEnglishComments
Density 1.16 g/cc0.0419 lb/in³A Component; ASTM D1475
 1.20 g/cc0.0434 lb/in³B Component; ASTM D1475
Brookfield Viscosity 360 cP360 cPB Component; Spindle #2; speed 50 rpm; ASTM D1824
 2000 cP2000 cPA Component; Spindle #3; speed 10 rpm; ASTM D1824
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore D 8787Cured property; ASTM D2240
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 5.00e+15 ohm-cm5.00e+15 ohm-cmCured property; ASTM D257
Dielectric Constant 3.1
@Frequency 1000 Hz
3.1
@Frequency 1000 Hz
Cured property; ASTM D150
Dissipation Factor 0.010
@Frequency 1000 Hz
0.010
@Frequency 1000 Hz
Cured property; ASTM D150
 
Thermal PropertiesMetricEnglishComments
CTE, linear  72.0 µm/m-°C
@Temperature 20.0 °C
40.0 µin/in-°F
@Temperature 68.0 °F
Cured property; alpha 1; Perkin Elmer TMS-2
 188 µm/m-°C
@Temperature 20.0 °C
104 µin/in-°F
@Temperature 68.0 °F
Cured property; alpha 2; Perkin Elmer TMS-2
Glass Transition Temp, Tg 130 °C266 °FCured property; Perkin Elmer TMS-2
Flash Point >= 150 °C>= 302 °FB Component; ASTM D92
 >= 200 °C>= 392 °FA Component; ASTM D92
 
Optical PropertiesMetricEnglishComments
Transmission, Visible 0.000 %0.000 %opaque; thickness not quantified
IR Transmittance 90.0 %90.0 %transparent; thickness not quantified
 
Processing PropertiesMetricEnglishComments
Processing Temperature 115 °C239 °FCure 12 hrs.

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