Parker Chomerics CHO-BOND 592 Conductive Epoxy

Parker Chomerics CHO-BOND 592 Conductive Epoxy 物性表: Parker Chomerics CHO-BOND 592 Conductive Epoxy物性表及特性介绍,Parker Chomerics CHO-BOND 592 Conductive Epoxy注塑参数详情,如需Parker Chomerics CHO-BOND 592 Conductive Epoxy下载, 可到相关下载区下载
 
Physical PropertiesMetricEnglishComments
Specific Gravity 2.35 - 2.85 g/cc2.35 - 2.85 g/cc
Thickness 25.4 microns1.00 milRecommended
 
Mechanical PropertiesMetricEnglishComments
Shear Strength >= 10.3 MPa>= 1500 psiLap
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity <= 0.050 ohm-cm<= 0.050 ohm-cmDC
 
Thermal PropertiesMetricEnglishComments
Maximum Service Temperature, Air 99.0 °C210 °F
Minimum Service Temperature, Air -62.0 °C-79.6 °F
 
Processing PropertiesMetricEnglishComments
Cure Time  5.00 min
@Temperature 302 °C
0.0833 hour
@Temperature 576 °F
 15.0 min
@Temperature 125 °C
0.250 hour
@Temperature 257 °F
 30.0 min
@Temperature 100 °C
0.500 hour
@Temperature 212 °F
 60.0 min
@Temperature 80.0 °C
1.00 hour
@Temperature 176 °F
 10100 min
@Temperature 24.0 °C
168 hour
@Temperature 75.2 °F
produces lower electrical conductivity
Pot Life  240 - 360 min
@Temperature 25.0 °C
240 - 360 min
@Temperature 77.0 °F
 2880 min
@Temperature 5.00 °C
2880 min
@Temperature 41.0 °F
Shelf Life 9.00 Month9.00 Month
 
Descriptive Properties
BinderEpoxy
ColorSilver
ConsistencyNearly Liquid
Coverage170.3 cm2/g
FillerAg
Mix Ratio100 to 50A:B
Working Life4 hrs

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