Parker Chomerics CHO-BOND 360-208 Conductive Epoxy

Parker Chomerics CHO-BOND 360-208 Conductive Epoxy 物性表: Parker Chomerics CHO-BOND 360-208 Conductive Epoxy物性表及特性介绍,Parker Chomerics CHO-BOND 360-208 Conductive Epoxy注塑参数详情,如需Parker Chomerics CHO-BOND 360-208 Conductive Epoxy下载, 可到相关下载区下载
 
Physical PropertiesMetricEnglishComments
Specific Gravity 3.60 - 4.40 g/cc3.60 - 4.40 g/cc
Volatile Organic Compounds (VOC) Content 0.00 g/l0.00 g/l
Thickness >= 254 microns>= 10.0 mil
 
Mechanical PropertiesMetricEnglishComments
Shear Strength 9.65 MPa
@Temperature 100 °C,
Time 2700 sec
1400 psi
@Temperature 212 °F,
Time 0.750 hour
Lap
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity <= 0.010 ohm-cm
@Temperature 100 °C,
Time 2700 sec
<= 0.010 ohm-cm
@Temperature 212 °F,
Time 0.750 hour
 
Thermal PropertiesMetricEnglishComments
Maximum Service Temperature, Air 100 °C212 °F
Minimum Service Temperature, Air -62.0 °C-79.6 °F
 
Processing PropertiesMetricEnglishComments
Cure Time  15.0 min
@Temperature 115 °C
0.250 hour
@Temperature 239 °F
 45.0 min
@Temperature 100 °C
0.750 hour
@Temperature 212 °F
 60.0 min
@Temperature 95.0 °C
1.00 hour
@Temperature 203 °F
 120 min
@Temperature 66.0 °C
2.00 hour
@Temperature 151 °F
 1440 min
@Temperature 24.0 °C
24.0 hour
@Temperature 75.2 °F
Pot Life 60 min60 min
Shelf Life 9.00 Month9.00 Month
 
Descriptive Properties
BinderEpoxy
ConsistencyThick Paste
Coverage9.9 cm2 / g
FillerAg/Cu, Ag
Mix Ratio100:33
Working Life1 hr

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