Cookson Group Plaskon® S-7LA Molding Compound

Cookson Group Plaskon® S-7LA Molding Compound 物性表: Cookson Group Plaskon® S-7LA Molding Compound物性表及特性介绍,Cookson Group Plaskon® S-7LA Molding Compound注塑参数详情,如需Cookson Group Plaskon® S-7LA Molding Compound下载, 可到相关下载区下载
  • 密度 [g/cm3]: 1.82
  • 弯曲强度 [MPa]: 62.0
  • 弯曲模量 [MPa]: 12.0
 
Physical PropertiesMetricEnglishComments
Density 1.82 g/cc0.0658 lb/in³
Viscosity 17000 cP
@Temperature 175 °C
17000 cP
@Temperature 347 °F
Automatic orifice Viscosity
Linear Mold Shrinkage 0.0037 cm/cm0.0037 in/in
Spiral Flow 85.0 - 115 cm33.5 - 45.3 in177°C/1000 psi
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore D 7575
Tensile Strength, Ultimate 62.0 MPa8990 psi
Flexural Strength 103 MPa14900 psi
Flexural Modulus 12.0 GPa1740 ksi
 
Electrical PropertiesMetricEnglishComments
Dielectric Constant 3.8
@Frequency 1000 Hz
3.8
@Frequency 1000 Hz
Dielectric Strength 16.0 kV/mm406 kV/in
Dissipation Factor 0.0020
@Frequency 1000 Hz
0.0020
@Frequency 1000 Hz
Arc Resistance 180 sec180 sec
 
Thermal PropertiesMetricEnglishComments
CTE, linear 17.0 µm/m-°C
@Temperature 20.0 °C
9.44 µin/in-°F
@Temperature 68.0 °F
CTE, linear, Transverse to Flow 45.0 µm/m-°C
@Temperature 20.0 °C
25.0 µin/in-°F
@Temperature 68.0 °F
Thermal Conductivity 0.700 W/m-K4.86 BTU-in/hr-ft²-°F
Glass Transition Temp, Tg 150 °C302 °F
Flammability, UL94  V-0
@Thickness 1.60 mm
V-0
@Thickness 0.0630 in
 V-0
@Thickness 1.60 mm
V-0
@Thickness 0.0630 in
 
Processing PropertiesMetricEnglishComments
Processing Temperature 170 - 185 °C338 - 365 °FMolding temperature

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