Cookson Group Plaskon® SMT-B-1LV Epoxy Molding Compound for PBGAs

Cookson Group Plaskon® SMT-B-1LV Epoxy Molding Compound for PBGAs 物性表: Cookson Group Plaskon® SMT-B-1LV Epoxy Molding Compound for PBGAs物性表及特性介绍,Cookson Group Plaskon® SMT-B-1LV Epoxy Molding Compound for PBGAs注塑参数详情,如需Cookson Group Plaskon® SMT-B-1LV Epoxy Molding Compound for PBGAs下载, 可到相关下载区下载
  • 密度 [g/cm3]: 1.88
  • 弯曲模量 [MPa]: 12.5
 
Physical PropertiesMetricEnglishComments
Density 1.88 g/cc0.0679 lb/in³
Viscosity 5000 cP
@Temperature 175 °C
5000 cP
@Temperature 347 °F
Shimadzu Viscosity, 1000 psi
Spiral Flow 130 cm51.2 in175°C/1000 psi
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore D 7272
Flexural Strength 70.0 MPa10200 psi
Flexural Modulus 12.5 GPa1810 ksi
 
Electrical PropertiesMetricEnglishComments
Electrical Resistivity 1.80e+16 ohm-cm1.80e+16 ohm-cm
Dielectric Constant 4.0
@Frequency 1000 Hz
4.0
@Frequency 1000 Hz
Dielectric Strength 28.0 kV/mm711 kV/in
 
Thermal PropertiesMetricEnglishComments
CTE, linear 14.0 µm/m-°C
@Temperature 20.0 °C
7.78 µin/in-°F
@Temperature 68.0 °F
CTE, linear, Transverse to Flow 58.0 µm/m-°C
@Temperature 20.0 °C
32.2 µin/in-°F
@Temperature 68.0 °F
Thermal Conductivity 0.700 W/m-K4.86 BTU-in/hr-ft²-°F
Glass Transition Temp, Tg 225 °C437 °F
Flammability, UL94  V-0
@Thickness 3.20 mm
V-0
@Thickness 0.126 in
 V-0
@Thickness 3.20 mm
V-0
@Thickness 0.126 in
 
Processing PropertiesMetricEnglishComments
Processing Temperature 170 - 185 °C338 - 365 °FMolding temperature

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