Cookson Group Plaskon® 2929BNSC Epoxy Molding Compound

Cookson Group Plaskon® 2929BNSC Epoxy Molding Compound 物性表: Cookson Group Plaskon® 2929BNSC Epoxy Molding Compound物性表及特性介绍,Cookson Group Plaskon® 2929BNSC Epoxy Molding Compound注塑参数详情,如需Cookson Group Plaskon® 2929BNSC Epoxy Molding Compound下载, 可到相关下载区下载
  • 密度 [g/cm3]: 1.92
  • 弯曲模量 [MPa]: 14.0
 
Physical PropertiesMetricEnglishComments
Density 1.92 g/cc0.0694 lb/in³
Spiral Flow 66.0 - 90.0 cm26.0 - 35.4 in177°C/1000 psi
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore D 8080
Flexural Strength 124 MPa18000 psi
Flexural Modulus 14.0 GPa2030 ksi
 
Electrical PropertiesMetricEnglishComments
Dielectric Constant 4.2
@Frequency 1000 Hz
4.2
@Frequency 1000 Hz
Dielectric Strength 17.0 kV/mm432 kV/in
Dissipation Factor 0.0040
@Frequency 1000 Hz
0.0040
@Frequency 1000 Hz
Arc Resistance 180 sec180 sec
 
Thermal PropertiesMetricEnglishComments
CTE, linear 27.0 µm/m-°C
@Temperature 20.0 °C
15.0 µin/in-°F
@Temperature 68.0 °F
in flow direction
CTE, linear, Transverse to Flow 80.0 µm/m-°C
@Temperature 20.0 °C
44.4 µin/in-°F
@Temperature 68.0 °F
Thermal Conductivity 0.900 W/m-K6.25 BTU-in/hr-ft²-°F
Glass Transition Temp, Tg 145 °C293 °F
Flammability, UL94  V-0
@Thickness 1.60 mm
V-0
@Thickness 0.0630 in
 V-0
@Thickness 1.60 mm
V-0
@Thickness 0.0630 in
 
Processing PropertiesMetricEnglishComments
Processing Temperature 171 - 193 °C340 - 379 °FMolding temperature

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