Momentive Performance Materials MP 4165 Melamine Phenolic Resin, Copper Adhesive, Low Shrinkage, Hig

Momentive Performance Materials MP 4165 Melamine Phenolic Resin, Copper Adhesive, Low Shrinkage, Hig 物性表: Momentive Performance Materials MP 4165 Melamine Phenolic Resin, Copper Adhesive, Low Shrinkage, Hig物性表及特性介绍,Momentive Performance Materials MP 4165 Melamine Phenolic Resin, Copper Adhesive, Low Shrinkage, Hig注塑参数详情,如需Momentive Performance Materials MP 4165 Melamine Phenolic Resin, Copper Adhesive, Low Shrinkage, Hig下载, 可到相关下载区下载
  • 密度 [g/cm3]: 1.81
  • 弯曲模量 [MPa]: 12.5
 
Physical PropertiesMetricEnglishComments
Density 1.81 g/cc0.0654 lb/in³ISO 1183
Apparent Bulk Density 0.700 g/cc0.0253 lb/in³ISO 60
Linear Mold Shrinkage, Flow -0.000500 cm/cm-0.000500 in/inCompression molding; ISO 2577
 0.00040 cm/cm0.00040 in/inInjection molding; ISO 2577
 
Mechanical PropertiesMetricEnglishComments
Ball Indentation Hardness 300 MPa43500 psiH 961/30; ISO 2039/P1
Tensile Strength at Break 60.0 MPa8700 psi5 mm/min; ISO 527 - 1/2
Tensile Modulus 12.5 GPa1810 ksi1 mm/min; ISO 527 - 1/2
Flexural Strength 105 MPa15200 psi2 mm/min; ISO 178
Flexural Modulus 12.5 GPa1810 ksiISO 178
Compressive Strength 160 MPa23200 psiTest specimen flat tested; ISO 604
Charpy Impact Unnotched 0.700 J/cm²
@Temperature 23.0 °C
3.33 ft-lb/in²
@Temperature 73.4 °F
ISO 179-1/2 eU
Charpy Impact, Notched 0.200 J/cm²
@Temperature 23.0 °C
0.952 ft-lb/in²
@Temperature 73.4 °F
ISO 179-1/2 eA
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 1.00e+12 ohm-cm1.00e+12 ohm-cmIEC 60093
Surface Resistance 1.00e+11 ohm1.00e+11 ohmIEC 60093
Dielectric Constant 7.0
@Frequency 100 Hz
7.0
@Frequency 100 Hz
IEC 60250
Dielectric Strength 30.0 kV/mm
@Thickness 1.00 mm
762 kV/in
@Thickness 0.0394 in
IEC 60243-P1
Dissipation Factor 0.080
@Frequency 100 Hz
0.080
@Frequency 100 Hz
IEC 60250
Comparative Tracking Index 300 V300 VTest liquid A; IEC 60112
 
Thermal PropertiesMetricEnglishComments
Maximum Service Temperature, Air 150 °C302 °F<20000 hours; IEC 60216-P1
 190 °C374 °F< 50 hours; IEC 60216-P1
Deflection Temperature at 8.0 MPa 135 °C275 °FISO 75-2
Shrinkage 0.25 %0.25 %Compression molding, 168 hours/110°C; ISO 2577
 0.29 %0.29 %Injection molding, 168 hours/110°C; ISO 2577
 
Processing PropertiesMetricEnglishComments
Feed Temperature 60.0 - 75.0 °C140 - 167 °FInjection molding
Nozzle Temperature 80.0 - 100 °C176 - 212 °FInjection molding
Melt Temperature 80.0 - 100 °C176 - 212 °FInjection molding
Mold Temperature 160 - 170 °C320 - 338 °FCompression molding
 160 - 170 °C320 - 338 °FInjection molding
Injection Pressure >= 15.0 MPa>= 2180 psiCompression and injection cavity mold pressure
Back Pressure 0.500 - 2.00 MPa72.5 - 290 psiInjection molding
Cure Time 0.167 - 0.333 min0.00278 - 0.00556 hourPer 1 mm of wall thickness, injection molding
 0.333 - 0.667 min0.00556 - 0.0111 hourPer 1 mm of wall thickness, compression molding
 
Descriptive Properties
Holding PressureApproximately 40-60% of injection pressure
Moisture Absorption13 mgISO 62, 24 hours at 23°C

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