- 密度 [g/cm3]: 1.81
- 弯曲模量 [MPa]: 12.5
Physical Properties | Metric | English | Comments | ||
---|---|---|---|---|---|
Density | 1.81 g/cc | 0.0654 lb/in³ | ISO 1183 | ||
Apparent Bulk Density | 0.700 g/cc | 0.0253 lb/in³ | ISO 60 | ||
Linear Mold Shrinkage, Flow | -0.000500 cm/cm | -0.000500 in/in | Compression molding; ISO 2577 | ||
0.00040 cm/cm | 0.00040 in/in | Injection molding; ISO 2577 | |||
Mechanical Properties | Metric | English | Comments | ||
Ball Indentation Hardness | 300 MPa | 43500 psi | H 961/30; ISO 2039/P1 | ||
Tensile Strength at Break | 60.0 MPa | 8700 psi | 5 mm/min; ISO 527 - 1/2 | ||
Tensile Modulus | 12.5 GPa | 1810 ksi | 1 mm/min; ISO 527 - 1/2 | ||
Flexural Strength | 105 MPa | 15200 psi | 2 mm/min; ISO 178 | ||
Flexural Modulus | 12.5 GPa | 1810 ksi | ISO 178 | ||
Compressive Strength | 160 MPa | 23200 psi | Test specimen flat tested; ISO 604 | ||
Charpy Impact Unnotched | 0.700 J/cm² @Temperature 23.0 °C | 3.33 ft-lb/in² @Temperature 73.4 °F | ISO 179-1/2 eU | ||
Charpy Impact, Notched | 0.200 J/cm² @Temperature 23.0 °C | 0.952 ft-lb/in² @Temperature 73.4 °F | ISO 179-1/2 eA | ||
Electrical Properties | Metric | English | Comments | ||
Volume Resistivity | 1.00e+12 ohm-cm | 1.00e+12 ohm-cm | IEC 60093 | ||
Surface Resistance | 1.00e+11 ohm | 1.00e+11 ohm | IEC 60093 | ||
Dielectric Constant | 7.0 @Frequency 100 Hz | 7.0 @Frequency 100 Hz | IEC 60250 | ||
Dielectric Strength | 30.0 kV/mm @Thickness 1.00 mm | 762 kV/in @Thickness 0.0394 in | IEC 60243-P1 | ||
Dissipation Factor | 0.080 @Frequency 100 Hz | 0.080 @Frequency 100 Hz | IEC 60250 | ||
Comparative Tracking Index | 300 V | 300 V | Test liquid A; IEC 60112 | ||
Thermal Properties | Metric | English | Comments | ||
Maximum Service Temperature, Air | 150 °C | 302 °F | <20000 hours; IEC 60216-P1 | ||
190 °C | 374 °F | < 50 hours; IEC 60216-P1 | |||
Deflection Temperature at 8.0 MPa | 135 °C | 275 °F | ISO 75-2 | ||
Shrinkage | 0.25 % | 0.25 % | Compression molding, 168 hours/110°C; ISO 2577 | ||
0.29 % | 0.29 % | Injection molding, 168 hours/110°C; ISO 2577 | |||
Processing Properties | Metric | English | Comments | ||
Feed Temperature | 60.0 - 75.0 °C | 140 - 167 °F | Injection molding | ||
Nozzle Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding | ||
Melt Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding | ||
Mold Temperature | 160 - 170 °C | 320 - 338 °F | Compression molding | ||
160 - 170 °C | 320 - 338 °F | Injection molding | |||
Injection Pressure | >= 15.0 MPa | >= 2180 psi | Compression and injection cavity mold pressure | ||
Back Pressure | 0.500 - 2.00 MPa | 72.5 - 290 psi | Injection molding | ||
Cure Time | 0.167 - 0.333 min | 0.00278 - 0.00556 hour | Per 1 mm of wall thickness, injection molding | ||
0.333 - 0.667 min | 0.00556 - 0.0111 hour | Per 1 mm of wall thickness, compression molding | |||
Descriptive Properties | |||||
Holding Pressure | Approximately 40-60% of injection pressure | ||||
Moisture Absorption | 13 mg | ISO 62, 24 hours at 23°C |