Bulk Molding Compounds BMC 940 Vinyl Ester Bipolar Plate Material

Bulk Molding Compounds BMC 940 Vinyl Ester Bipolar Plate Material 物性表: Bulk Molding Compounds BMC 940 Vinyl Ester Bipolar Plate Material物性表及特性介绍,Bulk Molding Compounds BMC 940 Vinyl Ester Bipolar Plate Material注塑参数详情,如需Bulk Molding Compounds BMC 940 Vinyl Ester Bipolar Plate Material下载, 可到相关下载区下载
  • 断裂伸长率 [%]: 38.0
  • 弯曲模量 [MPa]: 10.5
 
Physical PropertiesMetricEnglishComments
Specific Gravity 1.89 g/cc1.89 g/ccASTM D792
Water Absorption <= 0.060 %
@Temperature 23.0 °C,
Time 86400 sec
<= 0.060 %
@Temperature 73.4 °F,
Time 24.0 hour
ASTM D570
Linear Mold Shrinkage 0.00080 cm/cm0.00080 in/inASTM D955
 
Mechanical PropertiesMetricEnglishComments
Tensile Strength at Break 28.0 MPa4060 psiASM D638
Tensile Modulus 9.50 GPa1380 ksiASTM D638
Flexural Yield Strength 38.0 MPa5510 psiASTM D790
Flexural Modulus 10.5 GPa1520 ksiASTM D790
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 0.0143 ohm-cm0.0143 ohm-cmIn Plane (X,Y direction)
 0.03125 ohm-cm0.03125 ohm-cmThrough Plane (Z direction)
 
Thermal PropertiesMetricEnglishComments
Specific Heat Capacity 0.846 J/g-°C0.202 BTU/lb-°FE1461-92
Thermal Conductivity 13.4 W/m-K93.0 BTU-in/hr-ft²-°F
Glass Transition Temp, Tg 189 °C372 °F
Flammability, UL94 V-0
@Thickness 3.56 mm
V-0
@Thickness 0.140 in
 
Processing PropertiesMetricEnglishComments
Mold Temperature 149 - 160 °C300 - 320 °F
Cure Time 0.500 - 1.00 min0.00833 - 0.0167 hour
 
Descriptive Properties
Diffusivity0.0889 cm2/s
DMA-Modulus13.8@ 25°C, ASTM D4065
 3.1@ 200°C, ASTM D4065
 5.4@ 175°C, ASTM D4065
 6.8@ 150°C, ASTM D4065
 9.6@ 100°C, ASTM D4065
Flowability270 cm2
Post bake, 350°F15 minsafter reaching 350°f
Press Close Speed<2 secafter material begins flowing
Recommended tonnage>40 Mpaon projected part area

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