Aptek 2710A/B Low modulus silicone adhesive

Aptek 2710A/B Low modulus silicone adhesive 物性表: Aptek 2710A/B Low modulus silicone adhesive物性表及特性介绍,Aptek 2710A/B Low modulus silicone adhesive注塑参数详情,如需Aptek 2710A/B Low modulus silicone adhesive下载, 可到相关下载区下载
  • 密度 [g/cm3]: 1.19
 
Physical PropertiesMetricEnglishComments
Density 1.19 g/cc0.0430 lb/in³A Component; ASTM D1475
 1.19 g/cc0.0430 lb/in³B Component; ASTM D1475
Outgassing - Total Mass Loss 0.60 %0.60 %Cured property; at 10E-6 torr; ASTM D595
Collected Volatile Condensable Material 0.060 %0.060 %Cured property; at 10E-6 torr; ASTM D595
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore A 3535Cured property; ASTM D1002
Adhesive Bond Strength 1.90 MPa275 psiAl-to-Al Lap Shear; Cured property; bondline thickness on primed aluminum panels; ASTM D1002
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 200000 ohm-cm200000 ohm-cmCured property; HSC 51113
 
Thermal PropertiesMetricEnglishComments
Maximum Service Temperature, Air 260 °C500 °F
Minimum Service Temperature, Air -110 °C-166 °F
Glass Transition Temp, Tg -108 °C-162 °FCured property; TMA
Flash Point >= 150 °C>= 302 °FA Component; ASTM D92
 >= 150 °C>= 302 °FB Component; ASTM D92
 
Processing PropertiesMetricEnglishComments
Processing Temperature 65.0 °C149 °FCure 1 hrs
 150 °C302 °FCure 0.25 hrs

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