Physical Properties | Metric | English | Comments | ||
---|---|---|---|---|---|
Thickness | 38.1 microns | 1.50 mil | Mylar Carrier, Substrate | ||
127 microns | 5.00 mil | Poly, Interleave | |||
457 - 559 microns | 18.0 - 22.0 mil | Overall | |||
457 - 559 microns | 18.0 - 22.0 mil | Side 1 | |||
Mechanical Properties | Metric | English | Comments | ||
Hardness, Shore A | 35 - 45 | 35 - 45 | Compound Property | ||
Tensile Strength | >= 8.27 MPa | >= 1200 psi | Compound Property | ||
Elongation at Break | >= 750 % | >= 750 % | Compound Property | ||
Electrical Properties | Metric | English | Comments | ||
Dielectric Strength | >= 15.7 kV/mm | >= 400 kV/in | |||
Thermal Properties | Metric | English | Comments | ||
Maximum Service Temperature, Air | 232 °C | 450 °F | |||
Minimum Service Temperature, Air | -56.7 °C | -70.0 °F | |||
Processing Properties | Metric | English | Comments | ||
Cure Time | 15.0 min @Temperature 177 °C | 0.250 hour @Temperature 350 °F | Recommended Cure Cycle | ||
120 min @Temperature 204 °C | 2.00 hour @Temperature 400 °F | Recommended Postcure Cycle | |||
Shelf Life | 6.00 Month @Temperature 4.44 °C | 6.00 Month @Temperature 40.0 °F | From date of manufacture | ||
Descriptive Properties | |||||
Color | Naturally Translucent | ||||
Total Product Weight (oz/yd2) | 17.5 - 20.5 |