Parker Chomerics CHO-BOND 1030 Conductive Silicone Gasket Adhesive

Parker Chomerics CHO-BOND 1030 Conductive Silicone Gasket Adhesive 物性表: Parker Chomerics CHO-BOND 1030 Conductive Silicone Gasket Adhesive物性表及特性介绍,Parker Chomerics CHO-BOND 1030 Conductive Silicone Gasket Adhesive注塑参数详情,如需Parker Chomerics CHO-BOND 1030 Conductive Silicone Gasket Adhesive下载, 可到相关下载区下载
 
Physical PropertiesMetricEnglishComments
Specific Gravity 3.50 - 4.00 g/cc3.50 - 4.00 g/cc
Volatile Organic Compounds (VOC) Content 151 g/l151 g/l
Thickness 30.0 microns1.18 milRecommended
 
Mechanical PropertiesMetricEnglishComments
Shear Strength >= 1.38 MPa>= 200 psiLap
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity <= 0.050 ohm-cm<= 0.050 ohm-cmDC
 
Thermal PropertiesMetricEnglishComments
Maximum Service Temperature, Air 200 °C392 °F
Minimum Service Temperature, Air -55.0 °C-67.0 °F
 
Processing PropertiesMetricEnglishComments
Cure Time 10100 min168 hour@ Room Temperature
Shelf Life 6.00 Month6.00 Month
 
Descriptive Properties
BinderSilicone
ConsistencyGritty paste
Coverage18.5 cm2 / g
FillerAg/Cu
Mix Ratio1-part
Working Life0.5 hrs

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