Momentive Performance Materials PF 6501 Phenolic Formaldehyde Resin, Low Shrinkage

Momentive Performance Materials PF 6501 Phenolic Formaldehyde Resin, Low Shrinkage 物性表: Momentive Performance Materials PF 6501 Phenolic Formaldehyde Resin, Low Shrinkage物性表及特性介绍,Momentive Performance Materials PF 6501 Phenolic Formaldehyde Resin, Low Shrinkage注塑参数详情,如需Momentive Performance Materials PF 6501 Phenolic Formaldehyde Resin, Low Shrinkage下载, 可到相关下载区下载
  • 密度 [g/cm3]: 1.6
  • 弯曲模量 [MPa]: 12.5
 
Physical PropertiesMetricEnglishComments
Density 1.60 g/cc0.0578 lb/in³ISO 1183
Apparent Bulk Density 0.640 g/cc0.0231 lb/in³ISO 60
Linear Mold Shrinkage, Flow 0.0017 cm/cm0.0017 in/inCompression molding; ISO 2577
 0.0018 cm/cm0.0018 in/inInjection molding; ISO 2577
 
Mechanical PropertiesMetricEnglishComments
Ball Indentation Hardness 400 MPa58000 psiH 961/30; ISO 2039/P1
Flexural Strength 175 MPa25400 psi2 mm/min; ISO 178
Flexural Modulus 12.5 GPa1810 ksiISO 178
Charpy Impact Unnotched 1.20 J/cm²
@Temperature 23.0 °C
5.71 ft-lb/in²
@Temperature 73.4 °F
ISO 179-1/2 eU
Charpy Impact, Notched 0.350 J/cm²
@Temperature 23.0 °C
1.67 ft-lb/in²
@Temperature 73.4 °F
ISO 179-1/2 eA
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 1.00e+11 ohm-cm1.00e+11 ohm-cmIEC 60093
Surface Resistance 1.00e+10 ohm1.00e+10 ohmIEC 60093
Dielectric Constant 6.5
@Frequency 100 Hz
6.5
@Frequency 100 Hz
IEC 60250
Dielectric Strength 30.0 kV/mm
@Thickness 1.00 mm
762 kV/in
@Thickness 0.0394 in
IEC 60243-P1
Dissipation Factor 0.10
@Frequency 100 Hz
0.10
@Frequency 100 Hz
IEC 60250
 
Thermal PropertiesMetricEnglishComments
Deflection Temperature at 8.0 MPa 170 °C338 °FISO 75-2
Shrinkage 0.070 %0.070 %Compression molding, 168 hours/110°C; ISO 2577
 0.080 %0.080 %Injection molding, 168 hours/110°C; ISO 2577
 
Processing PropertiesMetricEnglishComments
Feed Temperature 60.0 - 75.0 °C140 - 167 °FInjection molding
Nozzle Temperature 80.0 - 100 °C176 - 212 °FInjection molding
Melt Temperature 80.0 - 100 °C176 - 212 °FInjection molding
Mold Temperature 160 - 190 °C320 - 374 °FInjection molding
 160 - 190 °C320 - 374 °FCompression molding
Injection Pressure >= 15.0 MPa>= 2180 psiCompression and injection cavity mold pressure
Back Pressure 0.500 - 2.00 MPa72.5 - 290 psiInjection molding
Cure Time 0.167 - 0.333 min0.00278 - 0.00556 hourPer 1 mm of wall thickness, injection molding
 0.333 - 0.667 min0.00556 - 0.0111 hourPer 1 mm of wall thickness, compression molding
 
Descriptive Properties
Chromatic SpectrumAll Colors
Creep Rupture StrengthVery Good
Holding PressureApproximately 40-60% of injection pressure
Media ResistanceVery Good
Moisture Absorption11 mgISO 62, 24 hours at 23°C
Reserves by Peak TemperatureVery High
Thermal ExpansionVery Slight

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