- 密度 [g/cm3]: 1.6
- 弯曲模量 [MPa]: 12.5
Physical Properties | Metric | English | Comments | ||
---|---|---|---|---|---|
Density | 1.60 g/cc | 0.0578 lb/in³ | ISO 1183 | ||
Apparent Bulk Density | 0.640 g/cc | 0.0231 lb/in³ | ISO 60 | ||
Linear Mold Shrinkage, Flow | 0.0017 cm/cm | 0.0017 in/in | Compression molding; ISO 2577 | ||
0.0018 cm/cm | 0.0018 in/in | Injection molding; ISO 2577 | |||
Mechanical Properties | Metric | English | Comments | ||
Ball Indentation Hardness | 400 MPa | 58000 psi | H 961/30; ISO 2039/P1 | ||
Flexural Strength | 175 MPa | 25400 psi | 2 mm/min; ISO 178 | ||
Flexural Modulus | 12.5 GPa | 1810 ksi | ISO 178 | ||
Charpy Impact Unnotched | 1.20 J/cm² @Temperature 23.0 °C | 5.71 ft-lb/in² @Temperature 73.4 °F | ISO 179-1/2 eU | ||
Charpy Impact, Notched | 0.350 J/cm² @Temperature 23.0 °C | 1.67 ft-lb/in² @Temperature 73.4 °F | ISO 179-1/2 eA | ||
Electrical Properties | Metric | English | Comments | ||
Volume Resistivity | 1.00e+11 ohm-cm | 1.00e+11 ohm-cm | IEC 60093 | ||
Surface Resistance | 1.00e+10 ohm | 1.00e+10 ohm | IEC 60093 | ||
Dielectric Constant | 6.5 @Frequency 100 Hz | 6.5 @Frequency 100 Hz | IEC 60250 | ||
Dielectric Strength | 30.0 kV/mm @Thickness 1.00 mm | 762 kV/in @Thickness 0.0394 in | IEC 60243-P1 | ||
Dissipation Factor | 0.10 @Frequency 100 Hz | 0.10 @Frequency 100 Hz | IEC 60250 | ||
Thermal Properties | Metric | English | Comments | ||
Deflection Temperature at 8.0 MPa | 170 °C | 338 °F | ISO 75-2 | ||
Shrinkage | 0.070 % | 0.070 % | Compression molding, 168 hours/110°C; ISO 2577 | ||
0.080 % | 0.080 % | Injection molding, 168 hours/110°C; ISO 2577 | |||
Processing Properties | Metric | English | Comments | ||
Feed Temperature | 60.0 - 75.0 °C | 140 - 167 °F | Injection molding | ||
Nozzle Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding | ||
Melt Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding | ||
Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding | ||
160 - 190 °C | 320 - 374 °F | Compression molding | |||
Injection Pressure | >= 15.0 MPa | >= 2180 psi | Compression and injection cavity mold pressure | ||
Back Pressure | 0.500 - 2.00 MPa | 72.5 - 290 psi | Injection molding | ||
Cure Time | 0.167 - 0.333 min | 0.00278 - 0.00556 hour | Per 1 mm of wall thickness, injection molding | ||
0.333 - 0.667 min | 0.00556 - 0.0111 hour | Per 1 mm of wall thickness, compression molding | |||
Descriptive Properties | |||||
Chromatic Spectrum | All Colors | ||||
Creep Rupture Strength | Very Good | ||||
Holding Pressure | Approximately 40-60% of injection pressure | ||||
Media Resistance | Very Good | ||||
Moisture Absorption | 11 mg | ISO 62, 24 hours at 23°C | |||
Reserves by Peak Temperature | Very High | ||||
Thermal Expansion | Very Slight |