Momentive Performance Materials PF 7595 Phenolic Formaldehyde Resin, Low Coefficient of Friction, Ga

Momentive Performance Materials PF 7595 Phenolic Formaldehyde Resin, Low Coefficient of Friction, Ga 物性表: Momentive Performance Materials PF 7595 Phenolic Formaldehyde Resin, Low Coefficient of Friction, Ga物性表及特性介绍,Momentive Performance Materials PF 7595 Phenolic Formaldehyde Resin, Low Coefficient of Friction, Ga注塑参数详情,如需Momentive Performance Materials PF 7595 Phenolic Formaldehyde Resin, Low Coefficient of Friction, Ga下载, 可到相关下载区下载
  • 密度 [g/cm3]: 1.57
  • 弯曲模量 [MPa]: 12.0
 
Physical PropertiesMetricEnglishComments
Density 1.57 g/cc0.0567 lb/in³ISO 1183
Apparent Bulk Density 0.880 g/cc0.0318 lb/in³ISO 60
Linear Mold Shrinkage, Flow 0.00050 cm/cm0.00050 in/inCompression molding; ISO 2577
 0.0020 cm/cm0.0020 in/inInjection molding; ISO 2577
 
Mechanical PropertiesMetricEnglishComments
Ball Indentation Hardness 450 MPa65300 psiH 961/30; ISO 2039/P1
Tensile Strength at Break 45.0 MPa6530 psi5 mm/min; ISO 527 - 1/2
Tensile Modulus 12.0 GPa1740 ksi1 mm/min; ISO 527 - 1/2
Flexural Strength 85.0 MPa12300 psi2 mm/min; ISO 178
Flexural Modulus 12.0 GPa1740 ksiISO 178
Compressive Strength 150 MPa21800 psiTest specimen flat tested; ISO 604
Charpy Impact Unnotched 0.350 J/cm²
@Temperature 23.0 °C
1.67 ft-lb/in²
@Temperature 73.4 °F
ISO 179-1/2 eU
 
Thermal PropertiesMetricEnglishComments
Maximum Service Temperature, Air 150 °C302 °F<20000 hours; IEC 60216-P1
 200 °C392 °F< 50 hours; IEC 60216-P1
Deflection Temperature at 8.0 MPa 175 °C347 °FISO 75-2
Shrinkage 0.10 %0.10 %Injection molding, 168 hours/110°C; ISO 2577
 0.10 %0.10 %Compression molding, 168 hours/110°C; ISO 2577
 
Processing PropertiesMetricEnglishComments
Feed Temperature 60.0 - 75.0 °C140 - 167 °FInjection molding
Nozzle Temperature 80.0 - 100 °C176 - 212 °FInjection molding
Melt Temperature 80.0 - 100 °C176 - 212 °FInjection molding
Mold Temperature 160 - 190 °C320 - 374 °FInjection molding
 160 - 190 °C320 - 374 °FCompression molding
Injection Pressure >= 15.0 MPa>= 2180 psiCompression and injection cavity mold pressure
Back Pressure 0.500 - 2.00 MPa72.5 - 290 psiInjection molding
Cure Time 0.167 - 0.333 min0.00278 - 0.00556 hourPer 1 mm of wall thickness, injection molding
 0.333 - 0.667 min0.00556 - 0.0111 hourPer 1 mm of wall thickness, compression molding
 
Descriptive Properties
Chromatic SpectrumAll Colors
Creep Rupture StrengthVery Good
Holding PressureApproximately 40-60% of injection pressure
Media ResistanceVery Good
Moisture Absorption6 mgISO 62, 24 hours at 23°C
Reserves by Peak TemperatureVery High
Thermal ExpansionVery Slight

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