Plaslok 5000 Black General Purpose Woodflour Filled Phenolic Molding Compound

Plaslok 5000 Black General Purpose Woodflour Filled Phenolic Molding Compound 物性表: Plaslok 5000 Black General Purpose Woodflour Filled Phenolic Molding Compound物性表及特性介绍,Plaslok 5000 Black General Purpose Woodflour Filled Phenolic Molding Compound注塑参数详情,如需Plaslok 5000 Black General Purpose Woodflour Filled Phenolic Molding Compound下载, 可到相关下载区下载
  • 密度 [g/cm3]: 1.38
  • 吸水率 [%]: 0.45
  • 断裂伸长率 [%]: 69.0
  • 弯曲强度 [MPa]: 52.0
  • 弯曲模量 [MPa]: 9.00
 
Physical PropertiesMetricEnglishComments
Density 1.38 g/cc0.0499 lb/in³ASTM D792
Apparent Bulk Density 0.620 g/cc0.0224 lb/in³ASTM D1895
Water Absorption 0.45 %0.45 %ASTM D570
Linear Mold Shrinkage 0.0060 cm/cm0.0060 in/inCompression; ASTM D955
 
Mechanical PropertiesMetricEnglishComments
Tensile Strength, Ultimate 52.0 MPa7540 psiASTM D638
Flexural Yield Strength 69.0 MPa10000 psiASTM D790
Flexural Modulus 9.00 GPa1310 ksiASTM D790
Compressive Yield Strength 207 MPa30000 psiASTM D695
 
Electrical PropertiesMetricEnglishComments
Electrical Resistivity 1.00e+12 ohm-cm1.00e+12 ohm-cmASTM D257
Dielectric Constant 4.74.71MHz; ASTM D150
 5.85.860 Hz; ASTM D150
Dielectric Strength 11.0 kV/mm279 kV/inASTM D149
Dissipation Factor 0.0300.0301 MHz; ASTM D150
 0.0600.06060 Hz; ASTM D150
Comparative Tracking Index 140 V140 VUL 746
 
Thermal PropertiesMetricEnglishComments
Deflection Temperature at 1.8 MPa (264 psi) 182 °C360 °FASTM D648
UL RTI, Electrical 150 °C
@Thickness 1.47 mm
302 °F
@Thickness 0.0579 in
UL RTI, Mechanical with Impact 150 °C
@Thickness 1.47 mm
302 °F
@Thickness 0.0579 in
UL RTI, Mechanical without Impact 150 °C
@Thickness 1.47 mm
302 °F
@Thickness 0.0579 in
Flammability, UL94 HBHB3.05mm
 HBHB3.05mm

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