- 密度 [g/cm3]: 1.96
- 弯曲强度 [MPa]: 7.24
Physical Properties | Metric | English | Comments |
---|---|---|---|
Density | 1.96 g/cc | 0.0708 lb/in³ | ASTM D1475 |
Moisture Absorption at Equilibrium | 0.15 % | 0.15 % | Cured property; ASTM D570 |
Outgassing - Total Mass Loss | 0.17 % | 0.17 % | Cured property at 125ºC at 10E-6 torr |
Collected Volatile Condensable Material | 0.010 % | 0.010 % | Cured property at 125ºC; at 10E-6 torr |
Mechanical Properties | Metric | English | Comments |
Tensile Strength, Ultimate | 7.24 MPa @Thickness 0.127 mm | 1050 psi @Thickness 0.00500 in | Cured; ASTM D638 |
Elongation at Break | 75 % @Thickness 0.127 mm | 75 % @Thickness 0.00500 in | Cured; ASTM D638 |
Tensile Modulus | 0.0138 GPa @Thickness 0.127 mm | 2.00 ksi @Thickness 0.00500 in | Cured; ASTM D638 |
Electrical Properties | Metric | English | Comments |
Volume Resistivity | 7.00e+14 ohm-cm | 7.00e+14 ohm-cm | Cured property; ASTM D257 |
Dielectric Constant | 5.8 @Frequency 1000 Hz | 5.8 @Frequency 1000 Hz | Cured property; ASTM D150 |
Dielectric Strength | 39.4 kV/mm @Thickness 0.127 mm | 1000 kV/in @Thickness 0.00500 in | Cured; ASTM D149 |
Dissipation Factor | 0.030 @Frequency 1000 Hz | 0.030 @Frequency 1000 Hz | Cured property; ASTM D150 |
Thermal Properties | Metric | English | Comments |
CTE, linear | 1.00 µm/m-°C @Temperature 20.0 °C | 0.556 µin/in-°F @Temperature 68.0 °F | Cured property; alpha 1 |
147 µm/m-°C @Temperature 20.0 °C | 81.7 µin/in-°F @Temperature 68.0 °F | Cured property; alpha 2 | |
Thermal Conductivity | 0.962 W/m-K | 6.67 BTU-in/hr-ft²-°F | |
Glass Transition Temp, Tg | -70.0 °C | -94.0 °F | Cured property; JMTP P-100 |