Aptek 2205 A/B Low modulus urethane stacking compound

Aptek 2205 A/B Low modulus urethane stacking compound 物性表: Aptek 2205 A/B Low modulus urethane stacking compound物性表及特性介绍,Aptek 2205 A/B Low modulus urethane stacking compound注塑参数详情,如需Aptek 2205 A/B Low modulus urethane stacking compound下载, 可到相关下载区下载
  • 密度 [g/cm3]: 0.99
  • 弯曲强度 [MPa]: 6.03
 
Physical PropertiesMetricEnglishComments
Density 0.990 g/cc0.0358 lb/in³A Component; ASTM D1475
 1.21 g/cc0.0437 lb/in³B Component; ASTM D1475
Viscosity 88 cP88 cPB Component; ASTM D1824
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore A 6565Cured property; ASTM D2240
Tensile Strength, Ultimate 6.03 MPa875 psiCured property; ASTM D412
Elongation at Break 265 %265 %Cured property; ASTM D412
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 1.30e+15 ohm-cm1.30e+15 ohm-cmCured property; ASTM D257
Dielectric Constant 3.5
@Frequency 1000 Hz
3.5
@Frequency 1000 Hz
Cured property; ASTM D150
Dissipation Factor 0.030
@Frequency 1000 Hz
0.030
@Frequency 1000 Hz
Cured property; ASTM D150
 
Thermal PropertiesMetricEnglishComments
CTE, linear  79.0 µm/m-°C
@Temperature 20.0 °C
43.9 µin/in-°F
@Temperature 68.0 °F
Cured property; alpha 1; JMTP P200
 185 µm/m-°C
@Temperature 20.0 °C
103 µin/in-°F
@Temperature 68.0 °F
Cured property; alpha 2; JMTP P200
Glass Transition Temp, Tg -70.0 °C-94.0 °FCured property; JMTP P-200
Flash Point >= 125 °C>= 257 °FB Component; ASTM D92
 >= 150 °C>= 302 °FA Component; ASTM D92
 
Processing PropertiesMetricEnglishComments
Processing Temperature 85.0 °C185 °FCure 4 hrs

转载请注明: 转自中国塑胶原料之家 http://www.su-jiao.com/wuxingbiao/

本文链接: http://www.su-jiao.com/yuanliaoku/show-36626.html

免责声明: 本文 Aptek 2205 A/B Low modulus urethane stacking compound 仅代表作者个人观点,中国塑胶原料之家无关。中国塑胶原料之家网所转载的内容,其版权均由原作者和资料提供方所拥有!如因作品版权问题需要处理,请与我们联络

塑胶原料之家,专业塑料网站、原料报价网站,免费发布塑胶供求信息。塑胶原料之家为您提供塑料供应、塑料求购、塑料行情、塑料展会、塑料原料资讯服务。

2008-2015 塑料|塑胶原料|物性表大全|UL黄卡|SGS报告查询|最新价格--塑胶原料之家

沪ICP备15027283号-4