Aptek 2120 PMF Low modulus urethane staking compound

Aptek 2120 PMF Low modulus urethane staking compound 物性表: Aptek 2120 PMF Low modulus urethane staking compound物性表及特性介绍,Aptek 2120 PMF Low modulus urethane staking compound注塑参数详情,如需Aptek 2120 PMF Low modulus urethane staking compound下载, 可到相关下载区下载
  • 密度 [g/cm3]: 0.98
 
Physical PropertiesMetricEnglishComments
Density 0.980 g/cc0.0354 lb/in³ASTM D1475
Viscosity 188000 cP188000 cPASTM D1824
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore A 6363Cured property; ASTM D2240
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 1.00e+15 ohm-cm1.00e+15 ohm-cmCured property; ASTM D257
Dielectric Constant 3.5
@Frequency 1000 Hz
3.5
@Frequency 1000 Hz
Cured property; ASTM D150
Dielectric Strength >= 13.8 kV/mm
@Thickness 0.127 mm
>= 350 kV/in
@Thickness 0.00500 in
Cured; ASTM D149
Dissipation Factor 0.024
@Frequency 1000 Hz
0.024
@Frequency 1000 Hz
Cured property; ASTM D150
 
Thermal PropertiesMetricEnglishComments
Glass Transition Temp, Tg -60.0 °C-76.0 °FCured property; JMTP P-200
Flash Point >= 150 °C>= 302 °FASTM D92
 
Processing PropertiesMetricEnglishComments
Processing Temperature 85.0 °C185 °FCure 5 hrs
 100 °C212 °FCure 3 hrs
 125 °C257 °FCure 1.5 hrs

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