- 密度 [g/cm3]: 1.67
| Physical Properties | Metric | English | Comments | ||
|---|---|---|---|---|---|
| Density | 1.67 g/cc | 0.0603 lb/in³ | |||
| Solids Content | 58 % | 58 % | |||
| Electrical Properties | Metric | English | Comments | ||
| Volume Resistivity | 0.00015 ohm-cm @Thickness 0.0254 mm | 0.00015 ohm-cm @Thickness 0.00100 in | film | ||
| Surface Resistivity per Square | <= 0.050 ohm @Thickness 0.0254 mm | <= 0.050 ohm @Thickness 0.00100 in | film | ||
| Thermal Properties | Metric | English | Comments | ||
| Maximum Service Temperature, Air | >= 107 °C | >= 225 °F | |||
| Processing Properties | Metric | English | Comments | ||
| Cure Time | 3.00 min @Temperature 260 °C | 0.0500 hour @Temperature 500 °F | Wave Solder | ||
| 90.0 min @Temperature 182 °C | 1.50 hour @Temperature 360 °F | ||||
| 300 min @Temperature 163 °C | 5.00 hour @Temperature 325 °F | Initial Cure | |||
| 5400 min @Temperature 182 °C | 90.0 hour @Temperature 360 °F | Press Cycle | |||
| Shelf Life | 6.00 Month | 6.00 Month | |||
| Descriptive Properties | |||||
| Adhesion | 5B | ASTM D3359-78 | |||
| Binder | Polyurethane | ||||
| Consistency | Thixotropic Paste | ||||
| Filler | Ag | ||||
| Resin | Polyurethane | ||||
| Theoretical Coverage | 4320 in2 / lb | Actual coverage will be 50-100% | |||