Cytec EN-2550 (Conap) Potting and Encapsulation Adhesive

Cytec EN-2550 (Conap) Potting and Encapsulation Adhesive 物性表: Cytec EN-2550 (Conap) Potting and Encapsulation Adhesive物性表及特性介绍,Cytec EN-2550 (Conap) Potting and Encapsulation Adhesive注塑参数详情,如需Cytec EN-2550 (Conap) Potting and Encapsulation Adhesive下载, 可到相关下载区下载
  • 密度 [g/cm3]: 1.48
  • 吸水率 [%]: 0.075
  • 弯曲强度 [MPa]: 26.2
 
Physical PropertiesMetricEnglishComments
Density 1.48 g/cc0.0535 lb/in³Cured
Water Absorption 0.075 %0.075 %24 hours
Water Absorption at Saturation 0.00187 %0.00187 %30 Days
Viscosity 3000 cP
@Temperature 25.0 °C
3000 cP
@Temperature 77.0 °F
Linear Mold Shrinkage 0.0058 cm/cm0.0058 in/in
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore D 6565
Tensile Strength, Ultimate 26.2 MPa3800 psi
Elongation at Break 32 %32 %
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity <= 2.10e+14 ohm-cm<= 2.10e+14 ohm-cm
Surface Resistance 6.10e+17 ohm6.10e+17 ohm
Dielectric Constant 4.13
@Frequency 1000 Hz
4.13
@Frequency 1000 Hz
Dielectric Strength 20.9 kV/mm
@Thickness 1.59 mm
530 kV/in
@Thickness 0.0625 in
Dissipation Factor 0.034
@Frequency 1000 Hz
0.034
@Frequency 1000 Hz
Arc Resistance >= 120 sec>= 120 sec
 
Thermal PropertiesMetricEnglishComments
CTE, linear 165 µm/m-°C
@Temperature 20.0 °C
91.7 µin/in-°F
@Temperature 68.0 °F
Thermal Conductivity 0.335 W/m-K2.32 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 130 °C266 °F
Minimum Service Temperature, Air -65.0 °C-85.0 °F
 
Processing PropertiesMetricEnglishComments
Cure Time 240 - 360 min4.00 - 6.00 hour100°C
 720 - 960 min12.0 - 16.0 hour60°C
 10080 - 14400 min168.0 - 240 hour25°C
Pot Life 35 - 40 min35 - 40 minValue for 1 lbm at 25°C
 
Descriptive Properties
ColorBlack

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