Cytec EN-2555 (Conap) Potting and Encapsulation Adhesive

Cytec EN-2555 (Conap) Potting and Encapsulation Adhesive 物性表: Cytec EN-2555 (Conap) Potting and Encapsulation Adhesive物性表及特性介绍,Cytec EN-2555 (Conap) Potting and Encapsulation Adhesive注塑参数详情,如需Cytec EN-2555 (Conap) Potting and Encapsulation Adhesive下载, 可到相关下载区下载
  • 密度 [g/cm3]: 1.48
  • 吸水率 [%]: 0.4
  • 弯曲强度 [MPa]: 13.8
 
Physical PropertiesMetricEnglishComments
Density 1.48 g/cc0.0535 lb/in³Cured
Water Absorption 0.40 %0.40 %24 hours
Water Absorption at Saturation 0.012 %0.012 %30 Days
Viscosity 600 cP
@Temperature 50.0 °C
600 cP
@Temperature 122 °F
Linear Mold Shrinkage >= 0.0060 cm/cm>= 0.0060 in/in
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore D 6565
Tensile Strength, Ultimate 13.8 MPa2000 psi
Elongation at Break 45 %45 %
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity <= 7.70e+13 ohm-cm<= 7.70e+13 ohm-cm
Surface Resistance 7.20e+14 ohm7.20e+14 ohm
Dielectric Constant 4.85
@Frequency 1000 Hz
4.85
@Frequency 1000 Hz
Dielectric Strength 18.5 kV/mm
@Thickness 1.59 mm
471 kV/in
@Thickness 0.0625 in
Dissipation Factor 0.035
@Frequency 1000 Hz
0.035
@Frequency 1000 Hz
Arc Resistance >= 190 sec>= 190 sec
 
Thermal PropertiesMetricEnglishComments
CTE, linear 114 µm/m-°C
@Temperature 20.0 °C
63.3 µin/in-°F
@Temperature 68.0 °F
Thermal Conductivity 0.154 W/m-K1.06 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 130 °C266 °F
Minimum Service Temperature, Air -55.0 °C-67.0 °F
 
Processing PropertiesMetricEnglishComments
Cure Time 1440 min24.0 hourFull Cure in 24 hrs at 100°C
Pot Life 40 - 50 min40 - 50 minValue for 1 lbm at 50°C
 
Descriptive Properties
ColorBlack

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