- 熔体流动速率 [g/10min]: 0.2
- 密度 [g/cm3]: 0.918
- 弯曲模量 [MPa]: 0.250
- 脆化温度 [℃]: -76.0
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Density | 0.918 g/cc | 0.0332 lb/in³ | base resin; ISO 1183 |
| 0.931 g/cc | 0.0336 lb/in³ | compound; ISO 1183 | |
| Environmental Stress Crack Resistance | >= 1000 hour @Temperature 50.0 °C | >= 1000 hour @Temperature 122 °F | Igepal 100%; F20; IEC 60811-4-1/B |
| Melt Flow | 0.20 g/10 min @Load 2.16 kg, Temperature 190 °C | 0.20 g/10 min @Load 4.76 lb, Temperature 374 °F | ISO 1133 |
| Mechanical Properties | Metric | English | Comments |
| Hardness, Shore D | 50 | 50 | 1s; ISO 868 |
| Tensile Strength at Break | >= 15.0 MPa | >= 2180 psi | 50mm/min; ISO 527 |
| Elongation at Break | >= 600 % | >= 600 % | 50mm/min; ISO 527 |
| Flexural Modulus | 0.250 GPa | 36.3 ksi | ISO 178 |
| Electrical Properties | Metric | English | Comments |
| Volume Resistivity | 1.00e+6 ohm-cm | 1.00e+6 ohm-cm | DC; IEC 60093 |
| Dielectric Constant | 2.5 @Frequency 1.00e+6 Hz | 2.5 @Frequency 1.00e+6 Hz | IEC 60250 |
| Dielectric Strength | >= 20.0 kV/mm | >= 508 kV/in | IEC 60243 |
| Dissipation Factor | 0.0060 @Frequency 1.00e+6 Hz | 0.0060 @Frequency 1.00e+6 Hz | IEC 60250 |
| Thermal Properties | Metric | English | Comments |
| Brittleness Temperature | <= -76.0 °C | <= -105 °F | ASTM D746 |
| Processing Properties | Metric | English | Comments |
| Processing Temperature | 80.0 - 100 °C | 176 - 212 °F | conductor preheating temperature |
| Melt Temperature | 200 - 210 °C | 392 - 410 °F | |