- 熔体流动速率 [g/10min]: 0.7
- 密度 [g/cm3]: 0.945
- 脆化温度 [℃]: -76.0
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Density | 0.945 g/cc | 0.0341 lb/in³ | ISO 1183/ISO 1872-2 |
| Environmental Stress Crack Resistance | >= 80 hour @Temperature 50.0 °C | >= 80 hour @Temperature 122 °F | Igepal 10%; F20; IEC 60811-4-1/B |
| Oxidative Induction Time (OIT) | >= 60 min @Temperature 200 °C | >= 60 min @Temperature 392 °F | IEC 60811-4-2/B |
| Melt Flow | 0.70 g/10 min @Load 2.16 kg, Temperature 190 °C | 0.70 g/10 min @Load 4.76 lb, Temperature 374 °F | ISO 1133 |
| Mechanical Properties | Metric | English | Comments |
| Hardness, Shore D | 58 | 58 | 15s; ISO 868 |
| Tensile Strength at Break | 20.0 MPa | 2900 psi | ISO 527 |
| Elongation at Break | >= 600 % | >= 600 % | ISO 527-2 |
| Electrical Properties | Metric | English | Comments |
| Volume Resistivity | 1.00e+6 ohm-cm | 1.00e+6 ohm-cm | IEC 60093 |
| Dielectric Constant | 2.33 @Frequency 1.00e+6 Hz | 2.33 @Frequency 1.00e+6 Hz | IEC 60250 |
| Dissipation Factor | 0.000070 | 0.000070 | IEC 60250 |
| Thermal Properties | Metric | English | Comments |
| Brittleness Temperature | <= -76.0 °C | <= -105 °F | ASTM D746 |
| Processing Properties | Metric | English | Comments |
| Processing Temperature | 100 - 120 °C | 212 - 248 °F | conductor preheating temperature |
| Melt Temperature | 220 - 250 °C | 428 - 482 °F | |
| Die Cooling Temperature | 30.0 - 50.0 °C | 86.0 - 122 °F | water cooling |