- 熔体流动速率 [g/10min]: 2.5
- 密度 [g/cm3]: 2.12
| Physical Properties | Metric | English | Comments | ||
|---|---|---|---|---|---|
| Density | 2.12 - 2.17 g/cc | 0.0766 - 0.0784 lb/in³ | ASTM D792 | ||
| Melt Flow | 2.5 - 5.0 g/10 min @Load 5.00 kg, Temperature 372 °C | 2.5 - 5.0 g/10 min @Load 11.0 lb, Temperature 702 °F | ASTM D1238 | ||
| Mechanical Properties | Metric | English | Comments | ||
| Tensile Strength at Break | 4.60 MPa @Temperature 280 °C | 667 psi @Temperature 536 °F | ASTM D1708 | ||
| >= 26.0 MPa @Temperature 23.0 °C | >= 3770 psi @Temperature 73.4 °F | ASTM D1708 | |||
| Elongation at Break | >= 300 % @Temperature 23.0 °C | >= 300 % @Temperature 73.4 °F | ASTM D1708 | ||
| 480 % @Temperature 280 °C | 480 % @Temperature 536 °F | ASTM D1708 | |||
| Tensile Modulus | 0.0490 GPa @Temperature 280 °C | 7.11 ksi @Temperature 536 °F | 1mm/min; ASTM D1708 | ||
| 0.500 - 0.600 GPa @Temperature 23.0 °C | 72.5 - 87.0 ksi @Temperature 73.4 °F | 1.0 mm/min; ASTM D1708 | |||
| Thermal Properties | Metric | English | Comments | ||
| Heat of Fusion | 34.0 - 45.0 J/g | 14.6 - 19.4 BTU/lb | DSC | ||
| 35.0 - 45.0 J/g | 15.1 - 19.4 BTU/lb | Crystallization Heat; DSC | |||
| CTE, linear | 120 - 200 µm/m-°C | 66.7 - 111 µin/in-°F | ASTM D696 | ||
| Specific Heat Capacity | 0.900 - 1.10 J/g-°C @Temperature 23.0 °C | 0.215 - 0.263 BTU/lb-°F @Temperature 73.4 °F | DSC | ||
| Thermal Conductivity | 0.200 W/m-K @Temperature 40.0 °C | 1.39 BTU-in/hr-ft²-°F @Temperature 104 °F | ASTM C177 | ||
| Melting Point | 310 - 325 °C | 590 - 617 °F | ASTM D3307 | ||
| Crystallization Temperature | 295 °C | 563 °F | Peak, DSC | ||
| Descriptive Properties | |||||
| Agency Ratings | ASTM D 3307 Type II | ||||
| Availability | Africa & Middle East | ||||
| Asia Pacific | |||||
| Europe | |||||
| North America | |||||
| South America | |||||
| Features | Flame Retardant | ||||
| High Heat Resistance | |||||
| Low Flow | |||||
| Semi Crystalline | |||||
| Forms | Pellets | ||||
| Generic | PFA | ||||
| Processing Method | Extrusion | ||||
| Uses | Aerospace Applications | ||||
| Cable Jacketing | |||||
| Liners | |||||
| Piping | |||||
| Semiconductor Molding Compounds | |||||
| Tubing | |||||