Arlon AD1000 PTFE/Woven Fiberglass/Ceramic Filled Laminate for Microwave Printed Circuit Boards

Arlon AD1000 PTFE/Woven Fiberglass/Ceramic Filled Laminate for Microwave Printed Circuit Boards 物性表: Arlon AD1000 PTFE/Woven Fiberglass/Ceramic Filled Laminate for Microwave Printed Circuit Boards物性表及特性介绍,Arlon AD1000 PTFE/Woven Fiberglass/Ceramic Filled Laminate for Microwave Printed Circuit Boards注塑参数详情,如需Arlon AD1000 PTFE/Woven Fiberglass/Ceramic Filled Laminate for Microwave Printed Circuit Boards下载, 可到相关下载区下载
  • 密度 [g/cm3]: 3.2
  • 吸水率 [%]: 0.03
 
Physical PropertiesMetricEnglishComments
Density 3.20 g/cc0.116 lb/in³ASTM D792 Method A
Water Absorption 0.030 %0.030 %IPC TM-650 2.6.2.1
Outgassing - Total Mass Loss  0.00 %
@Pressure <=1.33e-10 MPa,
Temperature 125 °C
0.00 %
@Pressure <=1.93e-8 psi,
Temperature 257 °F
Collected Volatiles; NASA SP-R-0022A
 0.00 %
@Pressure <=1.33e-10 MPa,
Temperature 125 °C
0.00 %
@Pressure <=1.93e-8 psi,
Temperature 257 °F
Water Vapor Recovered; NASA SP-R-0022A
 0.010 %
@Pressure <=1.33e-10 MPa,
Temperature 125 °C
0.010 %
@Pressure <=1.93e-8 psi,
Temperature 257 °F
NASA SP-R-0022A
 
Mechanical PropertiesMetricEnglishComments
Tensile Strength 29.6 MPa4300 psiCross; IPC TM-650 2.4.18.3
 35.2 MPa5100 psiMachine; IPC TM-650 2.4.18.3
Modulus of Elasticity 1.38 GPa200 ksiIPC TM-650 2.4.18.3
Flexural Strength 51.7 MPa7500 psiCross; IPC TM-650 2.4.4
 68.3 MPa9900 psiMachine; IPC TM-650 2.4.4
Compressive Modulus >= 2.93 GPa>= 425 ksiASTM D3410
Poissons Ratio 0.160.16ASTM D3039
Peel Strength >= 2.10 kN/m>= 12.0 pliTo Copper (1 oz./35 micron); After Thermal Stress; IPC TM-650 2.4.8
 2.38 kN/m13.6 pliTo Copper (1 oz./35 micron); At Elevated Temperatures; IPC TM-650 2.4.8.2
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 5.36e+13 ohm-cm5.36e+13 ohm-cmE24/125; IPC TM-650 2.5.17.1
 1.40e+15 ohm-cm1.40e+15 ohm-cmC96/35/90; IPC TM-650 2.5.17.1
Surface Resistance 3.16e+14 ohm3.16e+14 ohmE24/125; IPC TM-650 2.5.17.1
 1.80e+15 ohm1.80e+15 ohmC96/35/90; IPC TM-650 2.5.17.1
Dielectric Constant 10.2
@Frequency 1.00e+10 Hz
10.2
@Frequency 1.00e+10 Hz
may vary by thickness; IPC TM-650 2.5.5.5
Dielectric Strength 24.5 kV/mm622 kV/inIPC TM-650 2.5.6.2
Dielectric Breakdown >= 45000 V>= 45000 VIPC TM-650 2.5.6
Dissipation Factor 0.0023
@Frequency 1.00e+10 Hz
0.0023
@Frequency 1.00e+10 Hz
may vary by thickness; IPC TM-650 2.5.5.5
Arc Resistance >= 180 sec>= 180 secIPC TM-650 2.5.1
 
Thermal PropertiesMetricEnglishComments
CTE, linear 8.00 - 10.0 µm/m-°C
@Temperature 50.0 - 150 °C
4.44 - 5.56 µin/in-°F
@Temperature 122 - 302 °F
IPC TM-650 2.4.41
CTE, linear, Transverse to Flow 20.0 µm/m-°C
@Temperature 50.0 - 150 °C
11.1 µin/in-°F
@Temperature 122 - 302 °F
z direction; IPC TM-650 2.4.24
Thermal Conductivity 0.810 W/m-K5.62 BTU-in/hr-ft²-°FASTM E1461
Decomposition Temperature >= 500 °C>= 932 °FOnset; IPC TM-650 2.4.24.6
 >= 500 °C>= 932 °F5 percent; IPC TM-650 2.4.24.6
Flammability, UL94 V-0V-0
 
Descriptive Properties
IPC Delamination - T260 (minutes)> 60IPC TM-650 2.4.24.1
IPC Delamination - T288 (minutes)> 60IPC TM-650 2.4.24.1
IPC Delamination - T300 (minutes)> 60IPC TM-650 2.4.24.1
Temperature Coefficient of Dielectric (ppm/°C)-380IPC TM-650 2.5.5.5; at 10 GHz (-40 - 150°C)

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