- 密度 [g/cm3]: 3.2
- 吸水率 [%]: 0.03
Physical Properties | Metric | English | Comments | ||
---|---|---|---|---|---|
Density | 3.20 g/cc | 0.116 lb/in³ | ASTM D792 Method A | ||
Water Absorption | 0.030 % | 0.030 % | IPC TM-650 2.6.2.1 | ||
Outgassing - Total Mass Loss | 0.00 % @Pressure <=1.33e-10 MPa, Temperature 125 °C | 0.00 % @Pressure <=1.93e-8 psi, Temperature 257 °F | Collected Volatiles; NASA SP-R-0022A | ||
0.00 % @Pressure <=1.33e-10 MPa, Temperature 125 °C | 0.00 % @Pressure <=1.93e-8 psi, Temperature 257 °F | Water Vapor Recovered; NASA SP-R-0022A | |||
0.010 % @Pressure <=1.33e-10 MPa, Temperature 125 °C | 0.010 % @Pressure <=1.93e-8 psi, Temperature 257 °F | NASA SP-R-0022A | |||
Mechanical Properties | Metric | English | Comments | ||
Tensile Strength | 29.6 MPa | 4300 psi | Cross; IPC TM-650 2.4.18.3 | ||
35.2 MPa | 5100 psi | Machine; IPC TM-650 2.4.18.3 | |||
Modulus of Elasticity | 1.38 GPa | 200 ksi | IPC TM-650 2.4.18.3 | ||
Flexural Strength | 51.7 MPa | 7500 psi | Cross; IPC TM-650 2.4.4 | ||
68.3 MPa | 9900 psi | Machine; IPC TM-650 2.4.4 | |||
Compressive Modulus | >= 2.93 GPa | >= 425 ksi | ASTM D3410 | ||
Poissons Ratio | 0.16 | 0.16 | ASTM D3039 | ||
Peel Strength | >= 2.10 kN/m | >= 12.0 pli | To Copper (1 oz./35 micron); After Thermal Stress; IPC TM-650 2.4.8 | ||
2.38 kN/m | 13.6 pli | To Copper (1 oz./35 micron); At Elevated Temperatures; IPC TM-650 2.4.8.2 | |||
Electrical Properties | Metric | English | Comments | ||
Volume Resistivity | 5.36e+13 ohm-cm | 5.36e+13 ohm-cm | E24/125; IPC TM-650 2.5.17.1 | ||
1.40e+15 ohm-cm | 1.40e+15 ohm-cm | C96/35/90; IPC TM-650 2.5.17.1 | |||
Surface Resistance | 3.16e+14 ohm | 3.16e+14 ohm | E24/125; IPC TM-650 2.5.17.1 | ||
1.80e+15 ohm | 1.80e+15 ohm | C96/35/90; IPC TM-650 2.5.17.1 | |||
Dielectric Constant | 10.2 @Frequency 1.00e+10 Hz | 10.2 @Frequency 1.00e+10 Hz | may vary by thickness; IPC TM-650 2.5.5.5 | ||
Dielectric Strength | 24.5 kV/mm | 622 kV/in | IPC TM-650 2.5.6.2 | ||
Dielectric Breakdown | >= 45000 V | >= 45000 V | IPC TM-650 2.5.6 | ||
Dissipation Factor | 0.0023 @Frequency 1.00e+10 Hz | 0.0023 @Frequency 1.00e+10 Hz | may vary by thickness; IPC TM-650 2.5.5.5 | ||
Arc Resistance | >= 180 sec | >= 180 sec | IPC TM-650 2.5.1 | ||
Thermal Properties | Metric | English | Comments | ||
CTE, linear | 8.00 - 10.0 µm/m-°C @Temperature 50.0 - 150 °C | 4.44 - 5.56 µin/in-°F @Temperature 122 - 302 °F | IPC TM-650 2.4.41 | ||
CTE, linear, Transverse to Flow | 20.0 µm/m-°C @Temperature 50.0 - 150 °C | 11.1 µin/in-°F @Temperature 122 - 302 °F | z direction; IPC TM-650 2.4.24 | ||
Thermal Conductivity | 0.810 W/m-K | 5.62 BTU-in/hr-ft²-°F | ASTM E1461 | ||
Decomposition Temperature | >= 500 °C | >= 932 °F | Onset; IPC TM-650 2.4.24.6 | ||
>= 500 °C | >= 932 °F | 5 percent; IPC TM-650 2.4.24.6 | |||
Flammability, UL94 | V-0 | V-0 | |||
Descriptive Properties | |||||
IPC Delamination - T260 (minutes) | > 60 | IPC TM-650 2.4.24.1 | |||
IPC Delamination - T288 (minutes) | > 60 | IPC TM-650 2.4.24.1 | |||
IPC Delamination - T300 (minutes) | > 60 | IPC TM-650 2.4.24.1 | |||
Temperature Coefficient of Dielectric (ppm/°C) | -380 | IPC TM-650 2.5.5.5; at 10 GHz (-40 - 150°C) |