Arlon AD255C PTFE/Woven Fiberglass/Microdispersed Ceramic Filled Laminate for RF & Microwave PCBs

Arlon AD255C PTFE/Woven Fiberglass/Microdispersed Ceramic Filled Laminate for RF & Microwave PCBs 物性表: Arlon AD255C PTFE/Woven Fiberglass/Microdispersed Ceramic Filled Laminate for RF & Microwave PCBs物性表及特性介绍,Arlon AD255C PTFE/Woven Fiberglass/Microdispersed Ceramic Filled Laminate for RF & Microwave PCBs注塑参数详情,如需Arlon AD255C PTFE/Woven Fiberglass/Microdispersed Ceramic Filled Laminate for RF & Microwave PCBs下载, 可到相关下载区下载
  • 密度 [g/cm3]: 2.3
  • 吸水率 [%]: 0.04
 
Physical PropertiesMetricEnglishComments
Density 2.30 g/cc0.0831 lb/in³ASTM D792 Method A
Water Absorption 0.040 %0.040 %IPC TM-650 2.6.2.1
 
Mechanical PropertiesMetricEnglishComments
Tensile Strength 21.4 MPa3100 psiCross; IPC TM-650 2.4.18.3
 27.6 MPa4000 psiMachine; IPC TM-650 2.4.18.3
Modulus of Elasticity 2.76 GPa400 ksiIPC TM-650 2.4.18.3
Flexural Strength 61.4 MPa8900 psiCross; IPC TM-650 2.4.4
 74.5 MPa10800 psiMachine; IPC TM-650 2.4.4
Compressive Modulus >= 2.41 GPa>= 350 ksiASTM D3410
Poissons Ratio 0.270.27ASTM D3039
Peel Strength 2.10 kN/m12.0 pliTo Copper (1 oz./35 micron); After Thermal Stress; IPC TM-650 2.4.8
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 1.10e+15 ohm-cm1.10e+15 ohm-cmC96/35/90; IPC TM-650 2.5.17.1
Surface Resistance 4.50e+13 ohm4.50e+13 ohmC96/35/90; IPC TM-650 2.5.17.1
Dielectric Constant  2.55
@Frequency 1.00e+6 Hz
2.55
@Frequency 1.00e+6 Hz
may vary by thickness; IPC TM-650 2.5.5.3
 2.55
@Frequency 1.00e+10 Hz
2.55
@Frequency 1.00e+10 Hz
may vary by thickness; IPC TM-650 2.5.5.5
Dielectric Breakdown >= 45000 V>= 45000 VIPC TM-650 2.5.6
Dissipation Factor  0.0011
@Frequency 1.00e+6 Hz
0.0011
@Frequency 1.00e+6 Hz
IPC TM-650 2.5.5.3
 0.0015
@Frequency 1.00e+10 Hz
0.0015
@Frequency 1.00e+10 Hz
IPC TM-650 2.5.5.5
Arc Resistance >= 180 sec>= 180 secIPC TM-650 2.5.1
 
Thermal PropertiesMetricEnglishComments
CTE, linear 16.0 µm/m-°C
@Temperature 50.0 - 150 °C
8.89 µin/in-°F
@Temperature 122 - 302 °F
IPC TM-650 2.4.41
CTE, linear, Transverse to Flow 50.0 µm/m-°C
@Temperature 50.0 - 150 °C
27.8 µin/in-°F
@Temperature 122 - 302 °F
z direction; IPC TM-650 2.4.24
Thermal Conductivity 0.300 W/m-K2.08 BTU-in/hr-ft²-°FASTM E1461
Decomposition Temperature 495 °C923 °FOnset; IPC TM-650 2.4.24.6
 550 °C1020 °F5 percent; IPC TM-650 2.4.24.6
Flammability, UL94 V-0V-0
 
Descriptive Properties
IPC Delamination - T260 (minutes)>60IPC TM-650 2.4.24.1
IPC Delamination - T288 (minutes)>60IPC TM-650 2.4.24.1
IPC Delamination - T300 (minutes)>60IPC TM-650 2.4.24.1
Temperature Coefficient of Dielectric (ppm/°C)-75IPC TM-650 2.5.5.5; at 10 GHz (-40 - 150°C)

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