- 密度 [g/cm3]: 2.38
- 吸水率 [%]: 0.04
Physical Properties | Metric | English | Comments | ||
---|---|---|---|---|---|
Density | 2.38 g/cc | 0.0860 lb/in³ | ASTM D792 Method A | ||
Water Absorption | 0.040 % | 0.040 % | IPC TM-650 2.6.2.1 | ||
Outgassing - Total Mass Loss | 0.00 % @Pressure <=1.33e-10 MPa, Temperature 125 °C | 0.00 % @Pressure <=1.93e-8 psi, Temperature 257 °F | Collected Volatiles; NASA SP-R-0022A | ||
0.00 % @Pressure <=1.33e-10 MPa, Temperature 125 °C | 0.00 % @Pressure <=1.93e-8 psi, Temperature 257 °F | Water Vapor Recovered; NASA SP-R-0022A | |||
0.020 % @Pressure <=1.33e-10 MPa, Temperature 125 °C | 0.020 % @Pressure <=1.93e-8 psi, Temperature 257 °F | NASA SP-R-0022A | |||
Mechanical Properties | Metric | English | Comments | ||
Tensile Strength | 48.3 MPa | 7000 psi | Cross; IPC TM-650 2.4.18.3 | ||
56.5 MPa | 8200 psi | Machine; IPC TM-650 2.4.18.3 | |||
Modulus of Elasticity | 7.24 GPa | 1050 ksi | IPC TM-650 2.4.18.3 | ||
Flexural Strength | 120 MPa | 17400 psi | Cross; IPC TM-650 2.4.4 | ||
132 MPa | 19100 psi | Machine; IPC TM-650 2.4.4 | |||
Compressive Modulus | 1.55 GPa | 225 ksi | ASTM D3410 | ||
Poissons Ratio | 0.13 | 0.13 | ASTM D3039 | ||
Peel Strength | 1.23 kN/m | 7.00 pli | To Copper (1 oz./35 micron); After Process Solutions; IPC TM-650 2.4.8 | ||
1.23 kN/m | 7.00 pli | To Copper (1 oz./35 micron); After Thermal Stress; IPC TM-650 2.4.8 | |||
1.30 kN/m | 7.40 pli | To Copper (1 oz./35 micron); At Elevated Temperatures; IPC TM-650 2.4.8.2 | |||
Electrical Properties | Metric | English | Comments | ||
Volume Resistivity | 2.25e+14 ohm-cm | 2.25e+14 ohm-cm | E24/125; IPC TM-650 2.5.17.1 | ||
1.40e+15 ohm-cm | 1.40e+15 ohm-cm | C96/35/90; IPC TM-650 2.5.17.1 | |||
Surface Resistance | 1.30e+11 ohm | 1.30e+11 ohm | C96/35/90; IPC TM-650 2.5.17.1 | ||
7.52e+14 ohm | 7.52e+14 ohm | E24/125; IPC TM-650 2.5.17.1 | |||
Dielectric Constant | 2.98 @Frequency 1.00e+10 Hz | 2.98 @Frequency 1.00e+10 Hz | may vary by thickness; IPC TM-650 2.5.5.5 | ||
2.98 @Frequency 1.00e+6 Hz | 2.98 @Frequency 1.00e+6 Hz | may vary by thickness; IPC TM-650 2.5.5.3 | |||
2.75 @Thickness 0.0000787 mm | 2.75 @Thickness 0.00000310 in | ||||
2.85 @Thickness 0.000135 mm | 2.85 @Thickness 0.00000530 in | ||||
2.94 @Thickness 0.000241 mm | 2.94 @Thickness 0.00000950 in | ||||
2.98 @Thickness 0.00237 mm | 2.98 @Thickness 0.0000932 in | ||||
Dielectric Strength | 43.3 kV/mm | 1100 kV/in | IPC TM-650 2.5.6.2 | ||
Dielectric Breakdown | 64000 V | 64000 V | IPC TM-650 2.5.6 | ||
Dissipation Factor | 0.00225 @Temperature 0.000 °C | 0.00225 @Temperature 32.0 °F | |||
0.0025 @Temperature 100 °C | 0.0025 @Temperature 212 °F | ||||
0.0015 @Frequency 1.00e+6 Hz | 0.0015 @Frequency 1.00e+6 Hz | IPC TM-650 2.5.5.3 | |||
0.0023 @Frequency 1.00e+10 Hz | 0.0023 @Frequency 1.00e+10 Hz | IPC TM-650 2.5.5.5 | |||
Arc Resistance | 245 sec | 245 sec | IPC TM-650 2.5.1 | ||
Thermal Properties | Metric | English | Comments | ||
CTE, linear | 10.0 µm/m-°C @Temperature 50.0 - 150 °C | 5.56 µin/in-°F @Temperature 122 - 302 °F | x direction; IPC TM-650 2.4.41 | ||
12.0 µm/m-°C @Temperature 50.0 - 150 °C | 6.67 µin/in-°F @Temperature 122 - 302 °F | y direction; IPC TM-650 2.4.41 | |||
CTE, linear, Transverse to Flow | 34.0 µm/m-°C @Temperature 50.0 - 150 °C | 18.9 µin/in-°F @Temperature 122 - 302 °F | z direction; IPC TM-650 2.4.24 | ||
Thermal Conductivity | 0.500 W/m-K | 3.47 BTU-in/hr-ft²-°F | ASTM E1461 | ||
Decomposition Temperature | 493 °C | 919 °F | Onset; IPC TM-650 2.4.24.6 | ||
525 °C | 977 °F | 5 percent; IPC TM-650 2.4.24.6 | |||
Flammability, UL94 | V-0 | V-0 | |||
Descriptive Properties | |||||
IPC Delamination - T260 (minutes) | > 60 | IPC TM-650 2.4.24.1 | |||
IPC Delamination - T288 (minutes) | > 60 | IPC TM-650 2.4.24.1 | |||
IPC Delamination - T300 (minutes) | > 60 | IPC TM-650 2.4.24.1 | |||
Temperature Coefficient of Dielectric (ppm/°C) | -9 | IPC TM-650 2.5.5.5 | |||
Z-Axis Expansion (%) | 1.5 | IPC TM-650 2.4.24 (50-260°C) |