Rogers Corporation RT/duroid® 6035HTC Ceramic Filled PTFE Composite, High Power RF and Microwave

Rogers Corporation RT/duroid® 6035HTC Ceramic Filled PTFE Composite, High Power RF and Microwave 物性表: Rogers Corporation RT/duroid® 6035HTC Ceramic Filled PTFE Composite, High Power RF and Microwave物性表及特性介绍,Rogers Corporation RT/duroid® 6035HTC Ceramic Filled PTFE Composite, High Power RF and Microwave注塑参数详情,如需Rogers Corporation RT/duroid® 6035HTC Ceramic Filled PTFE Composite, High Power RF and Microwave下载, 可到相关下载区下载
  • 密度 [g/cm3]: 2.2
 
Physical PropertiesMetricEnglishComments
Density 2.20 g/cc0.0795 lb/in³ASTM D792
Moisture Absorption at Equilibrium 0.060 %0.060 %D24/23; IPC-TM-650 2.6.2.1; ASTM D570
Thickness 254 - 1520 microns10.0 - 60.0 milRange of Standard Thicknesses
 
Mechanical PropertiesMetricEnglishComments
Tensile Modulus 1.68 GPa244 ksiTD; 40 hours; 50%RH; ASTM D638
 2.27 GPa329 ksiMD; 40 hours; 50%RH; ASTM D638
Peel Strength 1.38 kN/m
@Temperature 288 °C,
Time 20.0 sec
7.90 pli
@Temperature 550 °F,
Time 0.00556 hour
IPC-TM-650 2.4.8
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 1.00e+14 ohm-cm1.00e+14 ohm-cmCondition A; Z direction; IPC 2.5.17.1
Surface Resistance 1.00e+14 ohm1.00e+14 ohmCondition A; Z direction; IPC 2.5.17.1
Dielectric Constant  3.45 - 3.55
@Frequency 1.00e+10 Hz
3.45 - 3.55
@Frequency 1.00e+10 Hz
Z direction; Process; IPC-TM-650 2.5.5.5
 3.6
@Frequency 8.00e+9 - 4.00e+10 Hz
3.6
@Frequency 8.00e+9 - 4.00e+10 Hz
Z direction; Design; Differential Phase Length Method
Dissipation Factor 0.0013
@Frequency 1.00e+10 Hz
0.0013
@Frequency 1.00e+10 Hz
Z direction; IPC-TM-650, 2.5.5.5
 
Thermal PropertiesMetricEnglishComments
CTE, linear  19.0 µm/m-°C
@Temperature -55.0 - 288 °C
10.6 µin/in-°F
@Temperature -67.0 - 550 °F
X-, Y-Direction; ASTM D3386
 39.0 µm/m-°C
@Temperature -55.0 - 288 °C
21.7 µin/in-°F
@Temperature -67.0 - 550 °F
Z-Direction; ASTM D3386
Thermal Conductivity 1.44 W/m-K
@Temperature 80.0 °C
9.99 BTU-in/hr-ft²-°F
@Temperature 176 °F
ASTM C518
Flammability, UL94 V-0V-0anticipated
 
Descriptive Properties
Dimensional Stability0.07 mm/mIPC-TM-650 2.4.3.8; X, Y direction; after etch, +E/150
 0.07 mm/mIPC-TM-650 2.4.3.9; X, Y direction; after etch, +E2/150
Thermal Coefficient of Dielectric Constant-66 ppm/°Cmod IPC-TM-650, 2.5.5.5; Z direction; -50°C to 150°C

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