Rogers Corporation RT/duroid® 6006 Ceramic-PTFE Composite Microwave Laminates

Rogers Corporation RT/duroid® 6006 Ceramic-PTFE Composite Microwave Laminates 物性表: Rogers Corporation RT/duroid® 6006 Ceramic-PTFE Composite Microwave Laminates物性表及特性介绍,Rogers Corporation RT/duroid® 6006 Ceramic-PTFE Composite Microwave Laminates注塑参数详情,如需Rogers Corporation RT/duroid® 6006 Ceramic-PTFE Composite Microwave Laminates下载, 可到相关下载区下载
  • 密度 [g/cm3]: 2.7
  • 弯曲强度 [MPa]: 17.0
  • 弯曲模量 [MPa]: 1.951
 
Physical PropertiesMetricEnglishComments
Density 2.70 g/cc0.0975 lb/in³ASTM D792
Moisture Absorption at Equilibrium 0.050 %
@Temperature 50.0 °C,
Time 173000 sec
0.050 %
@Temperature 122 °F,
Time 48.0 hour
0.05 in.; IPC-TM-650 2.6.2.1
Thickness 127 - 2540 microns5.00 - 100 milRange of Standard Thicknesses
Deformation  0.33 %
@Pressure 7.00 MPa,
Temperature 50.0 °C
0.33 %
@Pressure 1020 psi,
Temperature 122 °F
Z direction; 24 hrs; ASTM D621
 2.1 %
@Pressure 7.00 MPa,
Temperature 150 °C
2.1 %
@Pressure 1020 psi,
Temperature 302 °F
Z direction; 24 hrs; ASTM D621
 
Mechanical PropertiesMetricEnglishComments
Tensile Strength, Ultimate 17.0 MPa2470 psiY direction; 0.1/min strain rate; ASTM D638
 20.0 MPa2900 psiX direction; 0.1/min strain rate; ASTM D638
Elongation at Break 4.0 - 6.0 %4.0 - 6.0 %Y direction; 0.1/min strain rate; ASTM D638
 12 - 13 %12 - 13 %X direction; 0.1/min strain rate; ASTM D638
Tensile Modulus 3.56 GPa517 ksiY direction; 0.1/min strain rate; ASTM D638
 4.32 GPa627 ksiX direction; 0.1/min strain rate; ASTM D638
Flexural Strength 38.0 MPa5510 psiCondition A; ASTM D790
Flexural Modulus 1.951 GPa283.0 ksiY direction, Condition A; ASTM D790
 2.634 GPa382.0 ksiX direction, Condition A; ASTM D790
Compressive Yield Strength 54.0 MPa
@Strain 33.0 %
7830 psi
@Strain 33.0 %
Z direction; 0.05/min strain rate; ASTM D695
Compressive Modulus 1.069 GPa155.0 ksiZ direction; 0.05/min strain rate; ASTM D695
Peel Strength 2.51 kN/m14.3 pliCopper, after solder float; IPC-TM-650 2.4.8
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 2.00e+13 ohm-cm2.00e+13 ohm-cmCondition A; IPC 2.5.17.1
Surface Resistance 7.00e+13 ohm7.00e+13 ohmCondition A; IPC 2.5.17.1
Dielectric Constant  6.0 - 6.3
@Frequency 1.00e+10 Hz
6.0 - 6.3
@Frequency 1.00e+10 Hz
Process, Clamped stripline, Z-direction; IPC-TM-650 2.5.5.5
 6.45
@Frequency 8.00e+9 - 4.00e+10 Hz
6.45
@Frequency 8.00e+9 - 4.00e+10 Hz
Design, Z-direction; Differential Phase Length Method
Dissipation Factor 0.0027
@Frequency 1.00e+10 Hz
0.0027
@Frequency 1.00e+10 Hz
Z direction; IPC-TM-650 2.5.5.5
 
Thermal PropertiesMetricEnglishComments
CTE, linear  34.0 µm/m-°C
@Temperature 0.000 - 100 °C
18.9 µin/in-°F
@Temperature 32.0 - 212 °F
Y-Direction; 5°C/min; ASTM D3386
 47.0 µm/m-°C
@Temperature 0.000 - 100 °C
26.1 µin/in-°F
@Temperature 32.0 - 212 °F
X-Direction; 5°C/min; ASTM D3386
 117 µm/m-°C
@Temperature 0.000 - 100 °C
65.0 µin/in-°F
@Temperature 32.0 - 212 °F
Z-Direction; 5°C/min; ASTM D3386
Specific Heat Capacity 0.970 J/g-°C0.232 BTU/lb-°Fcalculated
Thermal Conductivity 0.490 W/m-K
@Temperature 80.0 °C
3.40 BTU-in/hr-ft²-°F
@Temperature 176 °F
ASTM C518
Decomposition Temperature 500 °C932 °FTGA; ASTM D3850
Flammability, UL94 V-0V-0
 
Descriptive Properties
Thermal Coefficient of Dielectric Constant-410 ppm/°CIPC-TM-650 2.5.5.5; 10 GHz; -50°C to 170°C; Z-Direction

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