Rogers Corporation RT/duroid® 5870 Glass Microfiber Reinforced PTFE High Frequency Laminate

Rogers Corporation RT/duroid® 5870 Glass Microfiber Reinforced PTFE High Frequency Laminate 物性表: Rogers Corporation RT/duroid® 5870 Glass Microfiber Reinforced PTFE High Frequency Laminate物性表及特性介绍,Rogers Corporation RT/duroid® 5870 Glass Microfiber Reinforced PTFE High Frequency Laminate注塑参数详情,如需Rogers Corporation RT/duroid® 5870 Glass Microfiber Reinforced PTFE High Frequency Laminate下载, 可到相关下载区下载
  • 密度 [g/cm3]: 2.2
  • 弯曲强度 [MPa]: 34.0
 
Physical PropertiesMetricEnglishComments
Density 2.20 g/cc0.0795 lb/in³ASTM D792
Moisture Absorption at Equilibrium 0.020 %
@Thickness 1.57 mm
0.020 %
@Thickness 0.0620 in
D48/50; ASTM D570
Thickness 127 - 3180 microns5.00 - 125 milRange of Thicknesses Available
 
Mechanical PropertiesMetricEnglishComments
Tensile Strength, Ultimate  34.0 MPa
@Temperature 100 °C
4930 psi
@Temperature 212 °F
X direction, Condition A; ASTM D638
 34.0 MPa
@Temperature 100 °C
4930 psi
@Temperature 212 °F
Y direction, Condition A; ASTM D638
 42.0 MPa
@Temperature 23.0 °C
6090 psi
@Temperature 73.4 °F
Y direction, Condition A; ASTM D638
 50.0 MPa
@Temperature 23.0 °C
7250 psi
@Temperature 73.4 °F
X direction, Condition A; ASTM D638
Elongation at Break  8.6 %
@Temperature 100 °C
8.6 %
@Temperature 212 °F
Y direction, Condition A; ASTM D638
 8.7 %
@Temperature 100 °C
8.7 %
@Temperature 212 °F
X direction, Condition A; ASTM D638
 9.8 %
@Temperature 23.0 °C
9.8 %
@Temperature 73.4 °F
X direction, Condition A; ASTM D638
 9.8 %
@Temperature 23.0 °C
9.8 %
@Temperature 73.4 °F
Y direction, Condition A; ASTM D638
Tensile Modulus  0.434 GPa
@Temperature 100 °C
63.0 ksi
@Temperature 212 °F
Y direction; ASTM D638
 0.490 GPa
@Temperature 100 °C
71.0 ksi
@Temperature 212 °F
X direction; ASTM D638
 1.28 GPa
@Temperature 23.0 °C
185 ksi
@Temperature 73.4 °F
Y direction; ASTM D638
 1.30 GPa
@Temperature 23.0 °C
189 ksi
@Temperature 73.4 °F
X direction; ASTM D638
Compressive Strength  23.0 MPa
@Strain 4.30 %,
Temperature 100 °C
3340 psi
@Strain 4.30 %,
Temperature 212 °F
X direction, Condition A; ASTM D695
 25.0 MPa
@Strain 3.30 %,
Temperature 100 °C
3630 psi
@Strain 3.30 %,
Temperature 212 °F
Y direction, Condition A; ASTM D695
 30.0 MPa
@Strain 4.00 %,
Temperature 23.0 °C
4350 psi
@Strain 4.00 %,
Temperature 73.4 °F
X direction, Condition A; ASTM D695
 37.0 MPa
@Strain 3.30 %,
Temperature 23.0 °C
5370 psi
@Strain 3.30 %,
Temperature 73.4 °F
Y direction, Condition A; ASTM D695
 37.0 MPa
@Strain 8.50 %,
Temperature 100 °C
5370 psi
@Strain 8.50 %,
Temperature 212 °F
Z direction, Condition A; ASTM D695
 54.0 MPa
@Strain 8.70 %,
Temperature 23.0 °C
7830 psi
@Strain 8.70 %,
Temperature 73.4 °F
Z direction, Condition A; ASTM D695
Compressive Modulus  0.520 GPa
@Temperature 100 °C
75.4 ksi
@Temperature 212 °F
Z direction, Condition A; ASTM D695
 0.680 GPa
@Temperature 100 °C
98.6 ksi
@Temperature 212 °F
X direction, Condition A; ASTM D695
 0.803 GPa
@Temperature 23.0 °C
116 ksi
@Temperature 73.4 °F
Z direction, Condition A; ASTM D695
 0.860 GPa
@Temperature 100 °C
125 ksi
@Temperature 212 °F
Y direction, Condition A; ASTM D695
 1.21 GPa
@Temperature 23.0 °C
175 ksi
@Temperature 73.4 °F
X direction, Condition A; ASTM D695
 1.36 GPa
@Temperature 23.0 °C
197 ksi
@Temperature 73.4 °F
Y direction, Condition A; ASTM D695
Peel Strength 4.77 kN/m27.2 pli1 oz EDC foil; after solder float; IPC-TM-650 2.4.8
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 2.00e+13 ohm-cm2.00e+13 ohm-cmZ direction; C96/35/90; ASTM D257
Surface Resistance 2.00e+13 ohm2.00e+13 ohmZ direction; C96/35/90; ASTM D257
Dielectric Constant  2.31 - 2.35
@Frequency 1.00e+10 Hz
2.31 - 2.35
@Frequency 1.00e+10 Hz
Process; Z direction; C24/23/50; IPC-TM-650 2.5.5.5
 2.33
@Frequency 8.00e+9 - 4.00e+10 Hz
2.33
@Frequency 8.00e+9 - 4.00e+10 Hz
Design; Z direction; C24/23/50; IPC-TM-650 2.5.5.5
Dissipation Factor  0.00050
@Frequency 1.00e+6 Hz
0.00050
@Frequency 1.00e+6 Hz
Z direction; C24/23/50; IPC-TM-650 2.5.5.3
 0.0012
@Frequency 1.00e+10 Hz
0.0012
@Frequency 1.00e+10 Hz
Z direction; C24/23/50; IPC-TM-650 2.5.5.5
 
Thermal PropertiesMetricEnglishComments
CTE, linear  22.0 µm/m-°C
@Temperature 0.000 - 100 °C
12.2 µin/in-°F
@Temperature 32.0 - 212 °F
X-Direction; IPC-TM-650 2.4.41
 28.0 µm/m-°C
@Temperature 0.000 - 100 °C
15.6 µin/in-°F
@Temperature 32.0 - 212 °F
Y-Direction; IPC-TM-650 2.4.41
 173 µm/m-°C
@Temperature 0.000 - 100 °C
96.1 µin/in-°F
@Temperature 32.0 - 212 °F
Z-Direction; IPC-TM-650 2.4.41
Specific Heat Capacity 0.960 J/g-°C0.229 BTU/lb-°Fcalculated
Thermal Conductivity 0.220 W/m-K
@Temperature 80.0 °C
1.53 BTU-in/hr-ft²-°F
@Temperature 176 °F
Z direction; ASTM C518
Deflection Temperature at 1.8 MPa (264 psi) >= 260 °C>= 500 °FX, Y direction; ASTM D648
Decomposition Temperature 500 °C932 °FTGA; ASTM D3850
Flammability, UL94 V-0V-0
 
Descriptive Properties
Thermal Coefficient of Dielectric Constant-115 ppm/°CIPC-TM-650 2.5.5.5; -50°C to 150°C

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