- 密度 [g/cm3]: 2.7
| Physical Properties | Metric | English | Comments | ||
|---|---|---|---|---|---|
| Density | 2.70 g/cc | 0.0975 lb/in³ | |||
| Water Absorption | <= 0.10 % | <= 0.10 % | D24/23; IPC-TM-2.4.8 | ||
| Thickness | 635 - 1270 microns | 25.0 - 50.0 mil | Range of Thicknesses Available | ||
| Mechanical Properties | Metric | English | Comments | ||
| Tensile Modulus | 3.19 GPa | 462 ksi | MD; ASTM D638 | ||
| 3.19 GPa | 462 ksi | TD; ASTM D638 | |||
| Peel Strength | 1.88 kN/m | 10.7 pli | Copper; 1 oz. EDC After Solder Float; IPC-TM-650 2.4.8 | ||
| Electrical Properties | Metric | English | Comments | ||
| Volume Resistivity | 1.00e+9 ohm-cm | 1.00e+9 ohm-cm | Cond. A; IPC 2.5.17.1 | ||
| Surface Resistance | 1.00e+9 ohm | 1.00e+9 ohm | Cond. A; IPC 2.5.17.1 | ||
| Dielectric Constant | 6.0 - 6.3 @Frequency 1.00e+10 Hz | 6.0 - 6.3 @Frequency 1.00e+10 Hz | Clamped stripline, Z-direction; IPC-TM-650 2.5.5.5 | ||
| 6.6 @Frequency 8.00e+9 - 4.00e+10 Hz | 6.6 @Frequency 8.00e+9 - 4.00e+10 Hz | Differential Phase Length Method, Z-Direction | |||
| Dissipation Factor | 0.0027 @Frequency 1.00e+10 Hz | 0.0027 @Frequency 1.00e+10 Hz | IPC-TM-650 2.5.5.5 | ||
| Thermal Properties | Metric | English | Comments | ||
| CTE, linear | 13.0 µm/m-°C @Temperature -55.0 - 288 °C | 7.22 µin/in-°F @Temperature -67.0 - 550 °F | X, Y- Direction; ASTM D3386-94 | ||
| 34.0 µm/m-°C @Temperature -55.0 - 288 °C | 18.9 µin/in-°F @Temperature -67.0 - 550 °F | Z-Direction; ASTM D3386-94 | |||
| Specific Heat Capacity | 0.850 J/g-°C | 0.203 BTU/lb-°F | Calculated | ||
| Thermal Conductivity | 0.670 W/m-K @Temperature 80.0 °C | 4.65 BTU-in/hr-ft²-°F @Temperature 176 °F | ASTM C518 | ||
| Decomposition Temperature | 500 °C | 932 °F | TGA; ASTM D3850 | ||
| Flammability, UL94 | V-0 | V-0 | |||
| Descriptive Properties | |||||
| Dimensional Stability | 0.8 mm/m | ASTM D257, Cond. A; X, Y-direction | |||
| Thermal Coefficient of Dielectric Constant | -212 ppm/°C | IPC-TM-650 2.5.5.5; 10 GHz; 0°C to 100°C; Z-Direction | |||