Cosmic Plastics E4905 Mineral Filled Epoxy Molding Compound, Encapsulated Grade

Cosmic Plastics E4905 Mineral Filled Epoxy Molding Compound, Encapsulated Grade 物性表: Cosmic Plastics E4905 Mineral Filled Epoxy Molding Compound, Encapsulated Grade物性表及特性介绍,Cosmic Plastics E4905 Mineral Filled Epoxy Molding Compound, Encapsulated Grade注塑参数详情,如需Cosmic Plastics E4905 Mineral Filled Epoxy Molding Compound, Encapsulated Grade下载, 可到相关下载区下载
  • 密度 [g/cm3]: 1.95
  • 吸水率 [%]: 0.25
  • 缺口冲击强度: 0.27
  • 弯曲强度 [MPa]: 55.0
  • 弯曲模量 [MPa]: 14.0
 
Physical PropertiesMetricEnglishComments
Density 1.95 g/cc0.0704 lb/in³
Apparent Bulk Density 0.780 g/cc0.0282 lb/in³
Water Absorption 0.25 %0.25 %48 hrs, 50°C
Linear Mold Shrinkage 0.0010 - 0.0040 cm/cm0.0010 - 0.0040 in/intypical.
 
Mechanical PropertiesMetricEnglishComments
Hardness, Barcol 6060
Tensile Strength, Ultimate 55.0 MPa7980 psi
Flexural Strength 83.0 MPa12000 psi
Flexural Modulus 14.0 GPa2030 ksi
Compressive Strength 241 MPa35000 psi
Izod Impact, Notched 0.270 J/cm0.506 ft-lb/in
 
Electrical PropertiesMetricEnglishComments
Electrical Resistivity 1.00e+15 ohm-cm1.00e+15 ohm-cm
Surface Resistance 1.00e+15 ohm1.00e+15 ohm
Dielectric Constant  4.2
@Frequency 1e+6 Hz
4.2
@Frequency 1e+6 Hz
Wet
 4.8
@Frequency 1000 Hz
4.8
@Frequency 1000 Hz
Wet
Dielectric Strength 13.0 kV/mm330 kV/inWet, Step by Step
Dissipation Factor  0.010
@Frequency 1e+6 Hz
0.010
@Frequency 1e+6 Hz
Wet
 0.012
@Frequency 1000 Hz
0.012
@Frequency 1000 Hz
Wet
Arc Resistance 180 sec180 sec
 
Thermal PropertiesMetricEnglishComments
CTE, linear 30.0 µm/m-°C
@Temperature 20.0 °C
16.7 µin/in-°F
@Temperature 68.0 °F
Alpha 1
CTE, linear, Transverse to Flow 80.0 µm/m-°C
@Temperature 20.0 °C
44.4 µin/in-°F
@Temperature 68.0 °F
Alpha 2
Thermal Conductivity 1.2561 W/m-K8.7173 BTU-in/hr-ft²-°F
Deflection Temperature at 1.8 MPa (264 psi) >= 200 °C>= 392 °F
Glass Transition Temp, Tg 110 °C230 °F
 
Processing PropertiesMetricEnglishComments
Processing Temperature 150 - 175 °C302 - 347 °FMolding temperature

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