Aptek 6109-A/B Epoxy Encapsulant

Aptek 6109-A/B Epoxy Encapsulant 物性表: Aptek 6109-A/B Epoxy Encapsulant物性表及特性介绍,Aptek 6109-A/B Epoxy Encapsulant注塑参数详情,如需Aptek 6109-A/B Epoxy Encapsulant下载, 可到相关下载区下载
  • 密度 [g/cm3]: 1.15
 
Physical PropertiesMetricEnglishComments
Density 1.15 g/cc0.0415 lb/in³A Component; ASTM D1475
 1.20 g/cc0.0434 lb/in³B Component; ASTM D1475
Viscosity 350 cP350 cPB Component; Spindle #2; speed 50 rpm; ASTM D1824
 20000 cP20000 cPA Component; Spindle #5; speed 10 rpm; ASTM D1824
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore D 8282Cured property; ASTM D2240
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity >= 1.00e+14 ohm-cm>= 1.00e+14 ohm-cmCured property; ASTM D257
Dielectric Constant 3.8
@Frequency 1000 Hz
3.8
@Frequency 1000 Hz
Cured property; ASTM D150
Dissipation Factor 0.015
@Frequency 1000 Hz
0.015
@Frequency 1000 Hz
Cured property; ASTM D150
 
Thermal PropertiesMetricEnglishComments
CTE, linear  99.0 µm/m-°C
@Temperature 20.0 °C
55.0 µin/in-°F
@Temperature 68.0 °F
Cured property; alpha 1; Perkin Elmer TMS-2
 225 µm/m-°C
@Temperature 20.0 °C
125 µin/in-°F
@Temperature 68.0 °F
Cured property; alpha 2; Perkin Elmer TMS-2
Glass Transition Temp, Tg 84.0 °C183 °FCured property; Perkin Elmer TMS-2
Flash Point >= 150 °C>= 302 °FB Component; ASTM D92
 >= 200 °C>= 392 °FA Component; ASTM D92
 
Optical PropertiesMetricEnglishComments
Refractive Index 1.481.48B Component
 1.5381.538Mixed Liquid
 1.571.57A Component
 
Processing PropertiesMetricEnglishComments
Processing Temperature 115 °C239 °FCure 8 hrs.

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